Posts by sales@ulpcb.com

Multi - layer PCB boards (usually referring to those with 4 layers or more), with the advantages of high - density wiring and small size, have become the core carriers for smartphones, servers, and au...

The performance and reliability of printed circuit boards (PCBs) depend not only on the inherent characteristics of the base materials but also on the precise control of the manufacturing process. Dif...

在HDI（高密度互连）板的制造过程中，激光钻孔是实现“微孔径，高密度互连”的核心工艺。它利用高能激光束的热或光化学效应来创建盲孔和埋孔（有时小至10μm以下），其直径通常在 25μm到150μm之间 在印刷电路板（PCB）基板上。这取代了传统机械钻孔无法实现的微小孔径加工，为高密度互连（HDI）板的“多层和微型化”发展提供了关键支持。与机械钻孔相比，激光钻孔具有“无工具磨损、高孔径精度以及与柔性/...