{"id":43,"date":"2025-08-17T10:22:52","date_gmt":"2025-08-17T02:22:52","guid":{"rendered":"https:\/\/ulpcb.com\/?page_id=43"},"modified":"2025-09-28T00:00:49","modified_gmt":"2025-09-27T16:00:49","slug":"ic-substrate-pcb","status":"publish","type":"page","link":"https:\/\/ulpcb.com\/sk\/pcb-product\/ic-substrate-pcb\/","title":{"rendered":"IC Substrate PCB"},"content":{"rendered":"<div data-elementor-type=\"wp-page\" data-elementor-id=\"43\" class=\"elementor elementor-43\">\n\t\t\t\t<div class=\"wd-negative-gap elementor-element elementor-element-05d2e5b e-flex e-con-boxed e-con e-parent\" data-id=\"05d2e5b\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t\t\t<div class=\"elementor-element elementor-element-1e4538b wd-el-breadcrumbs text-left elementor-widget elementor-widget-wd_element_breadcrumbs\" data-id=\"1e4538b\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"wd_element_breadcrumbs.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<nav class=\"wd-breadcrumbs\"><a href=\"https:\/\/ulpcb.com\/sk\/\">Home<\/a><span class=\"wd-delimiter\"><\/span><span class=\"wd-last\">Str\u00e1nka<\/span><\/nav>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"wd-negative-gap elementor-element elementor-element-47fcf19 e-flex e-con-boxed e-con e-parent\" data-id=\"47fcf19\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t<div class=\"elementor-element elementor-element-f1e7724 e-con-full e-flex e-con e-child\" data-id=\"f1e7724\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-33caab0 wd-width-100 elementor-widget elementor-widget-wd_images_gallery\" data-id=\"33caab0\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"wd_images_gallery.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"wd-images-gallery photoswipe-images wd-carousel-container\" style=\"--wd-align-items:center; --wd-justify-content:center;\">\n\t\t\t\t\t\t\t<div class=\"wd-carousel-inner\">\n\t\t\t\t\t\t<div class=\"wd-carousel wd-grid\" data-wrap=\"yes\" style=\"--wd-col-lg:1;--wd-col-md:1;--wd-col-sm:1;--wd-gap-lg:0px;\">\n\t\t\t\t\t\t\t\t\t<div class=\"wd-carousel-wrap\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<div class=\"wd-gallery-item wd-carousel-item\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t<a  href=\"https:\/\/ulpcb.com\/wp-content\/uploads\/2025\/09\/IC-package-substrate-PCB.webp\" data-width=\"500\" data-height=\"500\" data-index=\"1\" data-elementor-open-lightbox=\"no\">\n\t\t\t\t\t\t\n\t\t\t\t\t\t<img fetchpriority=\"high\" decoding=\"async\" width=\"400\" height=\"400\" src=\"https:\/\/ulpcb.com\/wp-content\/uploads\/2025\/09\/IC-package-substrate-PCB.webp\" class=\"attachment-600x400 size-600x400\" alt=\"IC packaging substrate materials have a core system of &quot;base material + copper foil + solder resist&quot;. For base materials, BT resin (with a dielectric constant of 3.0 - 3.5 and heat resistance above 260\u2103) and ABF insulating film (low - loss, suitable for fine lines below 10\u03bcm) are often used\" srcset=\"https:\/\/ulpcb.com\/wp-content\/uploads\/2025\/09\/IC-package-substrate-PCB.webp 500w, https:\/\/ulpcb.com\/wp-content\/uploads\/2025\/09\/IC-package-substrate-PCB-300x300.webp 300w, https:\/\/ulpcb.com\/wp-content\/uploads\/2025\/09\/IC-package-substrate-PCB-150x150.webp 150w, https:\/\/ulpcb.com\/wp-content\/uploads\/2025\/09\/IC-package-substrate-PCB-12x12.webp 12w\" sizes=\"(max-width: 400px) 100vw, 400px\" \/>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<\/a>\n\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<div class=\"wd-nav-arrows wd-pos-sep wd-hover-1 wd-icon-1\">\n\t\t\t<div class=\"wd-btn-arrow wd-prev wd-disabled\">\n\t\t\t\t<div class=\"wd-arrow-inner\"><\/div>\n\t\t\t<\/div>\n\t\t\t<div class=\"wd-btn-arrow wd-next\">\n\t\t\t\t<div class=\"wd-arrow-inner\"><\/div>\n\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t\t\n\t\t\t\t<\/div>\n\n\t\t\t\t\t\t<div class=\"wd-nav-pagin-wrap text-center wd-style-shape wd-hide-md-sm wd-hide-sm\">\n\t\t\t<ul class=\"wd-nav-pagin\"><\/ul>\n\t\t<\/div>\n\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-8a69c49 e-con-full e-flex e-con e-child\" data-id=\"8a69c49\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-d11c1ed elementor-widget elementor-widget-heading\" data-id=\"d11c1ed\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t\t<h1 class=\"elementor-heading-title elementor-size-default\">IC Substrate PCB<\/h1>\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-060556b elementor-widget elementor-widget-wd_text_block\" data-id=\"060556b\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"wd_text_block.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"wd-text-block reset-last-child text-left\">\n\t\t\t\n\t\t\t<h2>IC packaging substrate materials have a core system of \"base material + copper foil + solder resist\". For base materials, BT resin (with a dielectric constant of 3.0 - 3.5 and heat resistance above 260\u2103) and ABF insulating film (low - loss, suitable for fine lines below 10\u03bcm) are commonly used. In high - end scenarios, PI or PTFE is adopted. The copper foil selected is 1\/4 - 1\/2OZ ultra - thin electrolytic copper (roughness Ra\u22640.5\u03bcm) to ensure the formation of fine circuits. Photosensitive epoxy resin is used as the solder resist to achieve high - precision window - opening. These materials need to have low signal loss, high thermal conductivity, and thermal shock resistance to meet the requirements of high - density interconnection and reliability in chip packaging<\/h2>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-f8797c5 e-con-full e-flex e-con e-child\" data-id=\"f8797c5\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-2dc2fda elementor-widget elementor-widget-wd_popup\" data-id=\"2dc2fda\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"wd_popup.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div class=\"wd-button-wrapper text-left\" >\n\t\t\t<a class=\"btn btn-style-default btn-shape-rectangle btn-size-default wd-open-popup btn-color-primary btn-icon-pos-right\"  href=\"#quote\">\n\t\t\t\t<span class=\"wd-btn-text\" data-elementor-setting-key=\"text\">\n\t\t\t\t\tGet a Quote\t\t\t\t<\/span>\n\n\t\t\t\t\t\t\t\t\t<span class=\"wd-btn-icon\">\n\t\t\t\t\t\t<svg class=\"wd-icon e-font-icon-svg e-far-comment-alt\" viewbox=\"0 0 512 512\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M448 0H64C28.7 0 0 28.7 0 64v288c0 35.3 28.7 64 64 64h96v84c0 7.1 5.8 12 12 12 2.4 0 4.9-.7 7.1-2.4L304 416h144c35.3 0 64-28.7 64-64V64c0-35.3-28.7-64-64-64zm16 352c0 8.8-7.2 16-16 16H288l-12.8 9.6L208 428v-60H64c-8.8 0-16-7.2-16-16V64c0-8.8 7.2-16 16-16h384c8.8 0 16 7.2 16 16v288z\"><\/path><\/svg>\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t<\/a>\n\t\t<\/div>\n\t\t\t\t\t\t\t<div id=\"quote\" class=\"wd-popup wd-popup-element wd-entry-content mfp-hide\" style=\"--wd-popup-width:600px;\">\n\t\t\t\t\t\t\t<link rel=\"stylesheet\" id=\"elementor-post-402-css\" href=\"https:\/\/ulpcb.com\/wp-content\/uploads\/elementor\/css\/post-402.css?ver=1776455852\" type=\"text\/css\" media=\"all\">\n\t\t\t\t\t<div data-elementor-type=\"wp-post\" data-elementor-id=\"402\" class=\"elementor elementor-402\">\n\t\t\t\t<div class=\"wd-negative-gap elementor-element elementor-element-6a56237 e-flex e-con-boxed e-con e-parent\" data-id=\"6a56237\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t\t\t<div class=\"elementor-element elementor-element-c1ae61a elementor-widget elementor-widget-heading\" data-id=\"c1ae61a\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t\t<h3 class=\"elementor-heading-title elementor-size-default\">Get a Quote<\/h3>\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-920b755 fluentform-widget-submit-button-full-width elementor-widget elementor-widget-fluent-form-widget\" data-id=\"920b755\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"fluent-form-widget.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\n            <div class=\"fluentform-widget-wrapper hide-fluent-form-labels fluentform-widget-align-default\">\n\n            \n            <div class='fluentform ff-default fluentform_wrapper_4 ffs_default_wrap'><form data-form_id=\"4\" id=\"fluentform_4\" class=\"frm-fluent-form fluent_form_4 ff-el-form-top ff_form_instance_4_1 ff-form-loading ffs_default\" data-form_instance=\"ff_form_instance_4_1\" method=\"POST\" action=\"\" ><fieldset  style=\"border: none!important;margin: 0!important;padding: 0!important;background-color: transparent!important;box-shadow: none!important;outline: none!important; min-inline-size: 100%;\">\n                    <legend class=\"ff_screen_reader_title\" style=\"display: block; margin: 0!important;padding: 0!important;height: 0!important;text-indent: -999999px;width: 0!important;overflow:hidden;\">Get A quote<\/legend><input type='hidden' name='__fluent_form_embded_post_id' value='43' \/><input type=\"hidden\" id=\"_fluentform_4_fluentformnonce\" name=\"_fluentform_4_fluentformnonce\" value=\"d8f68d7c97\" \/><input type=\"hidden\" name=\"_wp_http_referer\" value=\"\/sk\/wp-json\/wp\/v2\/pages\/43\" \/><div class='ff-el-group'><div class=\"ff-el-input--label ff-el-is-required asterisk-right\"><label for='ff_4_name' id='label_ff_4_name' >Name<\/label><\/div><div class='ff-el-input--content'><input type=\"text\" name=\"name\" class=\"ff-el-form-control\" placeholder=\"Your Name *\" data-name=\"name\" id=\"ff_4_name\"  aria-invalid=\"false\" aria-required=\"true\"><\/div><\/div><div class='ff-el-group'><div class=\"ff-el-input--label ff-el-is-required asterisk-right\"><label for='ff_4_email' id='label_ff_4_email' aria-label=\"Email\">Email<\/label><\/div><div class='ff-el-input--content'><input type=\"email\" name=\"email\" id=\"ff_4_email\" class=\"ff-el-form-control\" placeholder=\"Email Address *\" data-name=\"email\"  aria-invalid=\"false\" aria-required=\"true\"><\/div><\/div><div class='ff-el-group'><div class=\"ff-el-input--label ff-el-is-required asterisk-right\"><label for='ff_4_subject' id='label_ff_4_subject' aria-label=\"Enter enquiry subject\">Enter enquiry subject<\/label><\/div><div class='ff-el-input--content'><input type=\"text\" name=\"subject\" value=\"IC Substrate PCB\" class=\"ff-el-form-control\" placeholder=\"Subject\" data-name=\"subject\" id=\"ff_4_subject\"  aria-invalid=\"false\" aria-required=\"true\"><\/div><\/div><div class='ff-el-group'><div class=\"ff-el-input--label ff-el-is-required asterisk-right\"><label for='ff_4_message' id='label_ff_4_message' aria-label=\"Your Message\">Your Message<\/label><\/div><div class='ff-el-input--content'><textarea aria-required=\"true\" aria-labelledby=\"label_ff_4_message\" name=\"message\" id=\"ff_4_message\" class=\"ff-el-form-control\" placeholder=\"Your Message *\" rows=\"4\" cols=\"2\" data-name=\"message\" ><\/textarea><\/div><\/div><div class='ff-el-group ff-text-left ff_submit_btn_wrapper'><button type=\"submit\" class=\"ff-btn ff-btn-submit ff-btn-md ff_btn_style\"  aria-label=\"Submit\">Submit <\/button><\/div><\/fieldset><input type=\"hidden\" name=\"trp-form-language\" value=\"sk\"\/><\/form><div id='fluentform_4_errors' class='ff-errors-in-stack ff_form_instance_4_1 ff-form-loading_errors ff_form_instance_4_1_errors'><\/div><\/div>            <script type=\"text\/javascript\">\n                window.fluent_form_ff_form_instance_4_1 = {\"id\":\"4\",\"ajaxUrl\":\"https:\\\/\\\/ulpcb.com\\\/wp-admin\\\/admin-ajax.php\",\"settings\":{\"layout\":{\"labelPlacement\":\"top\",\"helpMessagePlacement\":\"with_label\",\"errorMessagePlacement\":\"inline\",\"cssClassName\":\"\",\"asteriskPlacement\":\"asterisk-right\"},\"restrictions\":{\"denyEmptySubmission\":{\"enabled\":false}}},\"form_instance\":\"ff_form_instance_4_1\",\"form_id_selector\":\"fluentform_4\",\"rules\":{\"name\":{\"required\":{\"value\":true,\"message\":\"Toto pole je povinn\\u00e9\",\"global_message\":\"This field is required\",\"global\":true}},\"email\":{\"required\":{\"value\":true,\"message\":\"This field is required\",\"global\":false,\"global_message\":\"This field is required\"},\"email\":{\"value\":true,\"message\":\"This field must contain a valid email\",\"global\":false,\"global_message\":\"This field must contain a valid email\"}},\"subject\":{\"required\":{\"value\":true,\"message\":\"This field is required\",\"global\":false,\"global_message\":\"This field is required\"}},\"message\":{\"required\":{\"value\":true,\"message\":\"This field is required\",\"global\":false,\"global_message\":\"This field is required\"}}},\"debounce_time\":300};\n                            <\/script>\n                        <\/div>\n\n            \t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-82db08a elementor-widget elementor-widget-wd_button\" data-id=\"82db08a\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"wd_button.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"wd-button-wrapper text-left\" >\n\t\t\t<a class=\"btn btn-style-default btn-shape-rectangle btn-size-default btn-color-alt btn-icon-pos-right\"  href=\"https:\/\/ulpcb.com\/sk\/contact-us\/\">\n\t\t\t\t<span class=\"wd-btn-text\" data-elementor-setting-key=\"text\">\n\t\t\t\t\tMail us\t\t\t\t<\/span>\n\n\t\t\t\t\t\t\t\t\t<span class=\"wd-btn-icon\">\n\t\t\t\t\t\t<svg class=\"wd-icon e-font-icon-svg e-far-envelope\" viewbox=\"0 0 512 512\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M464 64H48C21.49 64 0 85.49 0 112v288c0 26.51 21.49 48 48 48h416c26.51 0 48-21.49 48-48V112c0-26.51-21.49-48-48-48zm0 48v40.805c-22.422 18.259-58.168 46.651-134.587 106.49-16.841 13.247-50.201 45.072-73.413 44.701-23.208.375-56.579-31.459-73.413-44.701C106.18 199.465 70.425 171.067 48 152.805V112h416zM48 400V214.398c22.914 18.251 55.409 43.862 104.938 82.646 21.857 17.205 60.134 55.186 103.062 54.955 42.717.231 80.509-37.199 103.053-54.947 49.528-38.783 82.032-64.401 104.947-82.653V400H48z\"><\/path><\/svg>\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t<\/a>\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-2d30610 elementor-widget-divider--view-line elementor-widget elementor-widget-divider\" data-id=\"2d30610\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"divider.default\">\n\t\t\t\t\t\t\t<div class=\"elementor-divider\">\n\t\t\t<span class=\"elementor-divider-separator\">\n\t\t\t\t\t\t<\/span>\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"wd-negative-gap elementor-element elementor-element-fa9a49b e-flex e-con-boxed e-con e-parent\" data-id=\"fa9a49b\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t\t\t<div class=\"elementor-element elementor-element-7589a90 e-n-tabs-none elementor-widget elementor-widget-n-tabs\" data-id=\"7589a90\" data-element_type=\"widget\" data-e-type=\"widget\" data-settings=\"{&quot;horizontal_scroll_mobile&quot;:&quot;enable&quot;,&quot;horizontal_scroll&quot;:&quot;disable&quot;}\" data-widget_type=\"nested-tabs.default\">\n\t\t\t\t\t\t\t<div class=\"e-n-tabs\" data-widget-number=\"123247248\" aria-label=\"C\u00e1c tab. M\u1edf m\u1ee5c b\u1eb1ng ph\u00edm Enter ho\u1eb7c Space, \u0111\u00f3ng b\u1eb1ng ph\u00edm Esc v\u00e0 di chuy\u1ec3n b\u1eb1ng c\u00e1c ph\u00edm m\u0169i t\u00ean.\" data-no-translation-aria-label=\"\">\n\t\t\t<div class=\"e-n-tabs-heading\" role=\"tablist\">\n\t\t\t\t\t<button id=\"e-n-tab-title-1232472481\" data-tab-title-id=\"e-n-tab-title-1232472481\" class=\"e-n-tab-title\" aria-selected=\"true\" data-tab-index=\"1\" role=\"tab\" tabindex=\"0\" aria-controls=\"e-n-tab-content-1232472481\" style=\"--n-tabs-title-order: 1;\">\n\t\t\t\t\t\t<span class=\"e-n-tab-title-text\">\n\t\t\t\tDescription\t\t\t<\/span>\n\t\t<\/button>\n\t\t\t\t\t<\/div>\n\t\t\t<div class=\"e-n-tabs-content\">\n\t\t\t\t<div id=\"e-n-tab-content-1232472481\" role=\"tabpanel\" aria-labelledby=\"e-n-tab-title-1232472481\" data-tab-index=\"1\" style=\"--n-tabs-title-order: 1;\" class=\"e-active elementor-element elementor-element-c126b89 e-con-full e-flex e-con e-child\" data-id=\"c126b89\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t<div class=\"wd-negative-gap elementor-element elementor-element-e9cb60b e-flex e-con-boxed e-con e-child\" data-id=\"e9cb60b\" data-element_type=\"container\" data-e-type=\"container\" data-settings=\"{&quot;background_background&quot;:&quot;classic&quot;}\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t\t\t<div class=\"elementor-element elementor-element-2e724e0 elementor-widget elementor-widget-wd_text_block\" data-id=\"2e724e0\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"wd_text_block.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"wd-text-block reset-last-child text-left\">\n\t\t\t\n\t\t\t<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">I. Base - material Pretreatment and Pattern Transfer (Procedures 1 - 3)<\/h3><ol class=\"auto-hide-last-sibling-br\"><li><strong>Base - material Cutting and Surface Activation<\/strong><div class=\"container-utlnW2 md-box-line-break wrapper-d0Cc1k undefined\">\u00a0<\/div>Select BT resin copper - clad laminates (core - board thickness of 0.1 - 0.2mm, copper - foil thickness of 1\/4OZ\/9\u03bcm). Cut them to the designed size (such as 150mm\u00d7150mm) using a laser cutting machine with an error of \u00b10.05mm. After cutting, activate the surface with a plasma processor (Ar\/O\u2082 mixed gas), increasing the surface energy of the base material from 30mN\/m to 45mN\/m to enhance the adhesion of the photosensitive film. Finally, bake at 120\u2103 for 1 hour to remove moisture, ensuring the water absorption rate is \u22640.03%.<\/li><li><strong>Photosensitive Film Coating and LDI Exposure<\/strong><div class=\"container-utlnW2 md-box-line-break wrapper-d0Cc1k undefined\">\u00a0<\/div>Coat an ultra - thin photosensitive film (thickness of 8 - 10\u03bcm, suitable for fine - line requirements) by roll - coating at a speed of 0.8m\/min. Use a Laser - Direct Imaging (LDI) system to expose with 355nm ultraviolet laser, achieving a resolution of 2\u03bcm to form the circuit pattern. After exposure, develop with a 0.8% sodium carbonate solution, controlling the development time at 60\u00b15 seconds to ensure no residual glue at the pattern edges.<\/li><li><strong>Fine - etching and Film Stripping<\/strong><div class=\"container-utlnW2 md-box-line-break wrapper-d0Cc1k undefined\">\u00a0<\/div>Use an acidic etchant (copper chloride concentration of 160g\/L, temperature of 38\u2103) and adopt the \"low - pressure spray + step - by - step etching\" process. The etching rate is 0.6\u03bcm\/min to etch the 1\/4OZ copper foil into inner - layer circuits with a line - width of 5 - 10\u03bcm, controlling the under - etching amount to \u22642\u03bcm. After etching, strip the film with a 5% sodium hydroxide solution, and then conduct an AOI inspection. Focus on checking for open - circuits, short - circuits, and line - width deviations (required to be \u2264\u00b11\u03bcm).<\/li><\/ol><h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">II. Inter - layer Interconnection and Stacking Construction (Procedures 4 - 6)<\/h3><ol class=\"auto-hide-last-sibling-br\" start=\"4\"><li><strong>Micro - blind - hole Processing<\/strong><div class=\"container-utlnW2 md-box-line-break wrapper-d0Cc1k undefined\">\u00a0<\/div>Use a UV laser drilling machine (wavelength of 355nm) to process micro - blind holes. Control the aperture within 20 - 50\u03bcm and the hole - position deviation at \u00b11\u03bcm. Before drilling, calibrate the reference holes of the base material through an X - ray positioning system to ensure the micro - blind holes are precisely aligned with the lower - layer circuits. After drilling, treat with a plasma desmear process (O\u2082\/CF\u2084 volume ratio of 4:1) to remove the resin residue and carbonized layer on the hole wall, with the hole - wall roughness Rz\u22645\u03bcm.<\/li><li><strong>Via Metallization and Electro - plating Thickening<\/strong><div class=\"container-utlnW2 md-box-line-break wrapper-d0Cc1k undefined\">\u00a0<\/div>First, conduct electroless copper plating to deposit a 0.5 - 1\u03bcm conductive layer on the hole wall to ensure hole - wall conductivity. Then, use a pulse electro - plating process (frequency of 20kHz, current density of 1A\/dm\u00b2) to thicken the copper layer on the hole wall to 8 - 12\u03bcm, and at the same time, electro - plate and thicken the circuit surface to 15\u03bcm. Monitor the plating solution temperature (25\u00b11\u2103) and pH value (10\u00b10.2) in real - time during electro - plating to avoid uneven copper thickness in the holes.<\/li><li><strong>Lamination and Stacking<\/strong><div class=\"container-utlnW2 md-box-line-break wrapper-d0Cc1k undefined\">\u00a0<\/div>Stack in the order of \"BT base material - prepreg (BT resin system) - inner - layer circuit board - prepreg - base material\". Select a low - resin - flow prepreg (resin - flow amount \u2264 15%) to ensure the board - thickness deviation after lamination is \u00b10.01mm. Use a vacuum hot - press for lamination and execute a temperature - control program: 80\u2103 (10kg\/cm\u00b2, 20min) for exhaust \u2192 150\u2103 (20kg\/cm\u00b2, 30min) for resin flow \u2192 180\u2103 (25kg\/cm\u00b2, 60min) for curing. After lamination, detect the inter - layer alignment accuracy through X - ray (deviation \u2264 \u00b12\u03bcm).<\/li><\/ol><h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">III. Outer - layer Processing and Packaging Adaptation (Procedures 7 - 10)<\/h3><ol class=\"auto-hide-last-sibling-br\" start=\"7\"><li><strong>Outer - layer Circuit Manufacturing<\/strong><div class=\"container-utlnW2 md-box-line-break wrapper-d0Cc1k undefined\">\u00a0<\/div>Repeat the \"photosensitive film coating - LDI exposure - etching\" process to make the outer - layer circuits with a line - width accuracy of \u00b11\u03bcm. The outer - layer circuits need to be precisely connected to the micro - blind holes. Ensure the alignment deviation is \u2264\u00b11.5\u03bcm through a CCD vision positioning system. After etching, conduct a second AOI inspection, focusing on checking the connection integrity between the outer - layer circuits and the blind holes.<\/li><li><strong>Solder - mask Layer Printing and Curing<\/strong><div class=\"container-utlnW2 md-box-line-break wrapper-d0Cc1k undefined\">\u00a0<\/div>Use screen - printing to coat photosensitive solder - mask ink (thickness of 10 - 15\u03bcm). The ink should be compatible with the BT resin base material, and the adhesion after curing should be \u22655B. Open windows for the pad areas through an LDI exposure machine. The window size should be 5 - 10\u03bcm larger than the pads to ensure accurate ball - mounting. The curing temperature of the solder - mask layer is 150\u2103 for 60 minutes to avoid substrate deformation due to high temperature.<\/li><li><strong>Surface Treatment (UBM Manufacturing)<\/strong><div class=\"container-utlnW2 md-box-line-break wrapper-d0Cc1k undefined\">\u00a0<\/div>To achieve the welding interconnection between the chip and the carrier board, a Under - Bump Metallization (UBM) layer needs to be made: First, electro - plate nickel (thickness of 5 - 8\u03bcm) in the pad area, and then electro - plate gold (thickness of 0.5 - 1\u03bcm), or use an electroless nickel - gold process. After surface treatment, detect the coating thickness with a profilometer, with a deviation of \u2264\u00b10.5\u03bcm to ensure the reliability of ball - mounting.<\/li><li><strong>Shape Processing and Finished - product Inspection<\/strong><div class=\"container-utlnW2 md-box-line-break wrapper-d0Cc1k undefined\">\u00a0<\/div>Cut the shape of the carrier board with a laser cutting machine with a cutting accuracy of \u00b10.02mm to avoid edge chipping caused by mechanical cutting. The finished product needs to pass three core inspections: \u2460 Electrical performance (flying - probe test for open - circuits and short - circuits, insulation resistance \u2265 10\u00b9\u00b9\u03a9); \u2461 High - frequency performance (network analyzer tests the insertion loss in the 10GHz frequency band to be \u22640.5dB\/cm); \u2462 Reliability (-40\u2103~125\u2103 temperature cycling for 1000 times, no delamination or hole - copper fracture). After passing, conduct laser marking according to packaging requirements to complete the production of the IC carrier board.<\/li><\/ol>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-1f0a75b elementor-widget elementor-widget-wd_image_or_svg\" data-id=\"1f0a75b\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"wd_image_or_svg.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\n\t\t<div class=\"wd-image text-left\">\n\t\t\t\t\t\t\t\t<img decoding=\"async\" width=\"500\" height=\"500\" src=\"https:\/\/ulpcb.com\/wp-content\/uploads\/2025\/09\/IC-package-substrate-PCB.webp\" class=\"attachment-full size-full\" alt=\"IC packaging substrate materials have a core system of &quot;base material + copper foil + solder resist&quot;. For base materials, BT resin (with a dielectric constant of 3.0 - 3.5 and heat resistance above 260\u2103) and ABF insulating film (low - loss, suitable for fine lines below 10\u03bcm) are often used\" srcset=\"https:\/\/ulpcb.com\/wp-content\/uploads\/2025\/09\/IC-package-substrate-PCB.webp 500w, https:\/\/ulpcb.com\/wp-content\/uploads\/2025\/09\/IC-package-substrate-PCB-300x300.webp 300w, https:\/\/ulpcb.com\/wp-content\/uploads\/2025\/09\/IC-package-substrate-PCB-150x150.webp 150w, https:\/\/ulpcb.com\/wp-content\/uploads\/2025\/09\/IC-package-substrate-PCB-12x12.webp 12w\" sizes=\"(max-width: 500px) 100vw, 500px\" \/>\t\t\t\t\t<\/div>\n\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>","protected":false},"excerpt":{"rendered":"<p>Home\u9875\u9762 IC Substrate PCB IC packaging substrate materials have a core system of &#8220;base material + copper foil + solder<\/p>","protected":false},"author":1,"featured_media":0,"parent":15,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"footnotes":""},"class_list":["post-43","page","type-page","status-publish","hentry"],"_links":{"self":[{"href":"https:\/\/ulpcb.com\/sk\/wp-json\/wp\/v2\/pages\/43","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/ulpcb.com\/sk\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/ulpcb.com\/sk\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/ulpcb.com\/sk\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/ulpcb.com\/sk\/wp-json\/wp\/v2\/comments?post=43"}],"version-history":[{"count":7,"href":"https:\/\/ulpcb.com\/sk\/wp-json\/wp\/v2\/pages\/43\/revisions"}],"predecessor-version":[{"id":1249,"href":"https:\/\/ulpcb.com\/sk\/wp-json\/wp\/v2\/pages\/43\/revisions\/1249"}],"up":[{"embeddable":true,"href":"https:\/\/ulpcb.com\/sk\/wp-json\/wp\/v2\/pages\/15"}],"wp:attachment":[{"href":"https:\/\/ulpcb.com\/sk\/wp-json\/wp\/v2\/media?parent=43"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}