{"id":1194,"date":"2025-09-27T18:05:35","date_gmt":"2025-09-27T10:05:35","guid":{"rendered":"https:\/\/ulpcb.com\/?page_id=1194"},"modified":"2025-10-09T21:23:42","modified_gmt":"2025-10-09T13:23:42","slug":"8oz-double-sided-thick-copper-pcb","status":"publish","type":"page","link":"https:\/\/ulpcb.com\/sk\/8oz-double-sided-thick-copper-pcb\/","title":{"rendered":"8OZ double &#8211; sided thick copper PCB"},"content":{"rendered":"<div data-elementor-type=\"wp-page\" data-elementor-id=\"1194\" class=\"elementor elementor-1194\">\n\t\t\t\t<div class=\"wd-negative-gap elementor-element elementor-element-521c3045 e-flex e-con-boxed e-con e-parent\" data-id=\"521c3045\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t\t\t<div class=\"elementor-element elementor-element-5b0ce358 wd-el-breadcrumbs text-left elementor-widget elementor-widget-wd_element_breadcrumbs\" data-id=\"5b0ce358\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"wd_element_breadcrumbs.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<nav class=\"wd-breadcrumbs\"><a href=\"https:\/\/ulpcb.com\/sk\/\">Home<\/a><span class=\"wd-delimiter\"><\/span><span class=\"wd-last\">Str\u00e1nka<\/span><\/nav>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"wd-negative-gap elementor-element elementor-element-39795bc0 e-flex e-con-boxed e-con e-parent\" data-id=\"39795bc0\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t<div class=\"elementor-element elementor-element-739df339 e-con-full e-flex e-con e-child\" data-id=\"739df339\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-4fe38745 wd-width-100 elementor-widget elementor-widget-wd_images_gallery\" data-id=\"4fe38745\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"wd_images_gallery.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"wd-images-gallery photoswipe-images wd-carousel-container\" style=\"--wd-align-items:center; --wd-justify-content:center;\">\n\t\t\t\t\t\t\t<div class=\"wd-carousel-inner\">\n\t\t\t\t\t\t<div class=\"wd-carousel wd-grid\" data-wrap=\"yes\" style=\"--wd-col-lg:1;--wd-col-md:1;--wd-col-sm:1;--wd-gap-lg:0px;\">\n\t\t\t\t\t\t\t\t\t<div class=\"wd-carousel-wrap\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<div class=\"wd-gallery-item wd-carousel-item\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t<a  href=\"https:\/\/ulpcb.com\/wp-content\/uploads\/2025\/09\/8-OZ-PCB-2.webp\" data-width=\"664\" data-height=\"500\" data-index=\"1\" data-elementor-open-lightbox=\"no\">\n\t\t\t\t\t\t\n\t\t\t\t\t\t<img fetchpriority=\"high\" decoding=\"async\" width=\"600\" height=\"400\" src=\"https:\/\/ulpcb.com\/wp-content\/uploads\/2025\/09\/8-OZ-PCB-2-600x400.webp\" class=\"attachment-600x400 size-600x400\" alt=\"An 8OZ PCB board (with a copper - foil thickness of approximately 275\u03bcm, as 1OZ\u224835\u03bcm) is a large - current - carrying printed circuit board. Its core processes are designed around &quot;thick - copper processing&quot; and &quot;current stability&quot;. High - Tg FR - 4 (Tg\u2265170\u2103) is selected as the base material to meet the heat - dissipation requirements of thick copper\" srcset=\"https:\/\/ulpcb.com\/wp-content\/uploads\/2025\/09\/8-OZ-PCB-2-600x400.webp 600w, https:\/\/ulpcb.com\/wp-content\/uploads\/2025\/09\/8-OZ-PCB-2-16x12.webp 16w\" sizes=\"(max-width: 600px) 100vw, 600px\" \/>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<\/a>\n\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<div class=\"wd-nav-arrows wd-pos-sep wd-hover-1 wd-icon-1\">\n\t\t\t<div class=\"wd-btn-arrow wd-prev wd-disabled\">\n\t\t\t\t<div class=\"wd-arrow-inner\"><\/div>\n\t\t\t<\/div>\n\t\t\t<div class=\"wd-btn-arrow wd-next\">\n\t\t\t\t<div class=\"wd-arrow-inner\"><\/div>\n\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t\t\n\t\t\t\t<\/div>\n\n\t\t\t\t\t\t<div class=\"wd-nav-pagin-wrap text-center wd-style-shape wd-hide-md-sm wd-hide-sm\">\n\t\t\t<ul class=\"wd-nav-pagin\"><\/ul>\n\t\t<\/div>\n\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-440d3323 e-con-full e-flex e-con e-child\" data-id=\"440d3323\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-59b0511e elementor-widget elementor-widget-heading\" data-id=\"59b0511e\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t\t<h1 class=\"elementor-heading-title elementor-size-default\">8OZ 2L PCB<\/h1>\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-56c34f96 elementor-widget elementor-widget-wd_text_block\" data-id=\"56c34f96\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"wd_text_block.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"wd-text-block reset-last-child text-left\">\n\t\t\t\n\t\t\t<h2>n 8OZ PCB board (with a copper - foil thickness of approximately 275\u03bcm, as 1OZ\u224835\u03bcm) is a large - current - carrying printed circuit board. Its core processes are designed around \"thick - copper processing\" and \"current stability\". High - Tg FR - 4 (Tg\u2265170\u2103) is selected as the base material to meet the heat - dissipation requirements of thick copper. During manufacturing, for the inner - layer thick copper, the etching time needs to be extended (using a ferric chloride solution with a rate of 1.2\u03bcm\/min) to avoid over - etching. High - viscosity prepreg (PP) is used for lamination, and a pressure of 30kg\/cm\u00b2 is applied to ensure the filling of the thick - copper gaps. After drilling, enhanced hole - wall treatment (plasma cleaning + double electroless copper plating) is required, and the copper thickness on the hole wall should reach over 30\u03bcm.\u00a0<\/h2>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-21b410bd e-con-full e-flex e-con e-child\" data-id=\"21b410bd\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-3fbed13a elementor-widget elementor-widget-wd_popup\" data-id=\"3fbed13a\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"wd_popup.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div class=\"wd-button-wrapper text-left\" >\n\t\t\t<a class=\"btn btn-style-default btn-shape-rectangle btn-size-default wd-open-popup btn-color-primary btn-icon-pos-right\"  href=\"#quote\">\n\t\t\t\t<span class=\"wd-btn-text\" 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Apri gli elementi con Invio o Spazio, chiudili con Esc e naviga con i tasti freccia.\" data-no-translation-aria-label=\"\">\n\t\t\t<div class=\"e-n-tabs-heading\" role=\"tablist\">\n\t\t\t\t\t<button id=\"e-n-tab-title-3237446381\" data-tab-title-id=\"e-n-tab-title-3237446381\" class=\"e-n-tab-title\" aria-selected=\"true\" data-tab-index=\"1\" role=\"tab\" tabindex=\"0\" aria-controls=\"e-n-tab-content-3237446381\" style=\"--n-tabs-title-order: 1;\">\n\t\t\t\t\t\t<span class=\"e-n-tab-title-text\">\n\t\t\t\tDescription\t\t\t<\/span>\n\t\t<\/button>\n\t\t\t\t\t<\/div>\n\t\t\t<div class=\"e-n-tabs-content\">\n\t\t\t\t<div id=\"e-n-tab-content-3237446381\" role=\"tabpanel\" aria-labelledby=\"e-n-tab-title-3237446381\" data-tab-index=\"1\" style=\"--n-tabs-title-order: 1;\" class=\"e-active elementor-element elementor-element-4108ea58 e-con-full e-flex e-con e-child\" data-id=\"4108ea58\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t<div class=\"wd-negative-gap elementor-element elementor-element-4663703e e-flex e-con-boxed e-con e-child\" data-id=\"4663703e\" data-element_type=\"container\" data-e-type=\"container\" data-settings=\"{&quot;background_background&quot;:&quot;classic&quot;}\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t\t\t<div class=\"elementor-element elementor-element-d6ca2 elementor-widget elementor-widget-wd_text_block\" data-id=\"d6ca2\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"wd_text_block.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"wd-text-block reset-last-child text-left\">\n\t\t\t\n\t\t\t<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">I. Materials: Ensuring Thick - copper Support and Temperature Resistance<\/h3><div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">High - Tg FR - 4 copper - clad laminates (Tg\u2265170\u2103, and Tg\u2265180\u2103 for some high - end scenarios) that meet the IPC - 4101 standard are selected. The specific characteristics and selection reasons are as follows:<\/div><div class=\"container-utlnW2 md-box-line-break wrapper-d0Cc1k undefined\">\u00a0<\/div><ul class=\"auto-hide-last-sibling-br\"><li><strong>Thermal Stability<\/strong>: High - Tg base materials are less likely to soften at high temperatures (such as a soldering temperature of 260\u2103), avoiding the risk of thick - copper layer detachment due to base - material deformation. Since the thickness of an 8OZ copper foil is 8 times that of a regular 1OZ copper foil, the base material needs to provide stronger support. Low - Tg base materials may cause the copper foil to warp at high temperatures.<\/li><li><strong>Mechanical Strength<\/strong>: The base material has a flexural strength of \u2265150MPa and a tensile strength of \u2265200MPa, which can withstand the stress after thick - copper etching and prevent the substrate from warping (the warpage of the finished board should be \u22640.75%).<\/li><li><strong>Dielectric Properties<\/strong>: The dielectric constant (at 1MHz) is \u22644.5, and the dielectric loss is \u22640.02, ensuring low signal interference during large - current transmission and adapting to the high - frequency requirements of industrial power supplies (such as a switching frequency of \u2265100kHz).<\/li><li><strong>Common Specifications<\/strong>: The thickness of the base material is mostly 1.6mm (suitable for regular high - power modules), and for some large - current scenarios, a 2.0mm - thick base material is used to enhance the heat - dissipation path (increasing the thickness of the base material can improve the heat - conduction efficiency and reduce the local temperature rise of the substrate).<\/li><\/ul><h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">II. Copper Foil: Ensuring Large - current Carrying Capacity and Processability<\/h3><div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">High - purity electrolytic copper foil (purity \u2265 99.9%) with a thickness of 275\u03bcm (8OZ) is used. The specific characteristic requirements are as follows:<\/div><div class=\"container-utlnW2 md-box-line-break wrapper-d0Cc1k undefined\">\u00a0<\/div><ul class=\"auto-hide-last-sibling-br\"><li><strong>Mechanical Properties<\/strong>: The tensile strength is \u2265300MPa, and the elongation is \u22658% (at room temperature) to avoid the breakage of thick copper during etching and bending. Due to the large thickness of the 8OZ copper foil, stress concentration occurs at the circuit edges after etching, and copper foil with a low elongation is prone to cracking.<\/li><li><strong>Surface Roughness<\/strong>: The roughness Ra of the copper - foil surface in contact with the base material is \u22643\u03bcm, and that of the non - contact surface is \u22641.5\u03bcm. Excessive roughness on the contact surface will increase the difficulty of etching (copper slag is likely to remain), while too low roughness will reduce the bonding force with the base material (which needs to be compensated by subsequent blackening treatment).<\/li><li><strong>Impurity Content<\/strong>: The content of impurities such as iron, zinc, and nickel is \u226450ppm to avoid the influence of impurities on the conductivity of the copper foil. In large - current scenarios, impurities can cause local resistance to increase, resulting in additional temperature rise.<\/li><li><strong>Selection Differences<\/strong>: Standard electrolytic copper foil is used in regular scenarios, and for high - frequency and large - current scenarios (such as new - energy inverters), high - ductility electrolytic copper foil (elongation \u2265 10%) can be selected to improve the thermal - cycling resistance (-40\u2103~125\u2103 for 100 cycles without cracks).<\/li><\/ul><h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">III. Adhesive: Ensuring the Bond between Thick Copper and the Base Material<\/h3><div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">The inter - layer bonding depends on high - viscosity prepreg (PP), which is mainly used for local reinforcement of double - sided PCBs (such as around vias). The selection requirements are as follows:<\/div><div class=\"container-utlnW2 md-box-line-break wrapper-d0Cc1k undefined\">\u00a0<\/div><ul class=\"auto-hide-last-sibling-br\"><li><strong>Resin Content<\/strong>: The resin content is \u226550%, and the fluidity (at 170\u2103\/10min) is \u226520%, ensuring that the resin can fully fill the gaps between thick - copper circuits during lamination (the line spacing of 8OZ copper foil is usually \u22650.3mm, and sufficient resin is required to avoid inter - layer bubbles).<\/li><li><strong>Temperature Resistance<\/strong>: After curing, Tg\u2265160\u2103, and the coefficient of thermal expansion (CTE) at the glass - transition temperature is \u226425ppm\/\u2103, matching the CTE of the base material and copper foil to reduce inter - layer stress during thermal cycling.<\/li><li><strong>Common Models<\/strong>: 7628 fabric - based PP (thickness of 0.18mm) or 2116 fabric - based PP (thickness of 0.1mm) is selected, adjusted according to the substrate thickness and thick - copper gaps to ensure the uniform thickness of the laminated substrate.<\/li><\/ul><h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">IV. Other Auxiliary Materials<\/h3><ul class=\"auto-hide-last-sibling-br\"><li><strong>Solder - mask Ink<\/strong>: High - temperature - resistant epoxy - resin solder - mask ink (such as the Taiyo Ink PSR - 4000 series) is selected. After curing, Tg\u2265150\u2103, and the temperature resistance meets the soldering requirement of 260\u2103\/10s. The insulation resistance is \u226510\u00b9\u00b2\u03a9 (500V DC) to prevent the risk of electric leakage in large - current scenarios. The color is mostly green (conventional) or black (for high - heat - dissipation requirements, as black ink can assist in heat dissipation after absorbing heat).<\/li><li><strong>Surface - treatment Materials<\/strong>:<ul class=\"auto-hide-last-sibling-br\"><li><strong>Soldering Area<\/strong>: Electro - plated nickel - gold (nickel thickness of 8 - 10\u03bcm, gold thickness of 1 - 3\u03bcm) is used. The nickel layer can enhance the bonding force with the copper foil, and the gold layer improves soldering reliability and anti - oxidation properties (large - current solder joints are prone to oxidation, and the gold layer can extend the service life).<\/li><li><strong>Non - soldering Area<\/strong>: Tin - plating (tin thickness of 5 - 8\u03bcm) is used, which is lower in cost than nickel - gold, and the tin layer can be directly soldered, suitable for mass - production scenarios.<\/li><\/ul><\/li><li><strong>Drilling Consumables<\/strong>: Tungsten - steel drill bits (diameter of 0.3 - 1.0mm) with a hardness of \u2265HRC65 are used to ensure that they can penetrate the thick - copper layer (275\u03bcm copper foil + 1.6mm base material) during drilling. The hole - wall roughness Ra\u22642\u03bcm to avoid excessive via impedance.<\/li><\/ul><h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">II. Complete Manufacturing Process: Optimizing the Process around the Characteristics of Thick Copper<\/h3><div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">The manufacturing process of an 8OZ double - sided PCB board optimizes the processing difficulties of thick copper (such as etching uniformity and via - metallization reliability) based on the conventional double - sided PCB process. The core process is divided into six stages: \"base - material pre - treatment \u2192 circuit formation \u2192 via metallization \u2192 surface treatment \u2192 shape processing \u2192 finished - product inspection\". The key points of each stage are as follows:<\/div><h4 class=\"header-vfC6AV auto-hide-last-sibling-br\">(1) Base - material Pre - treatment: Laying the Foundation for Thick - copper Processing<\/h4><ul class=\"auto-hide-last-sibling-br\"><li><strong>Base - material Cutting<\/strong>: Cut the high - Tg FR - 4 base material to the designed size (with an error of \u00b10.1mm) using a CNC cutting machine. After cutting, chamfer the board edges at 45\u00b0 (radius of 0.5mm) to prevent the board edges from scratching the copper foil during subsequent processes.<\/li><li><strong>Degreasing and Cleaning<\/strong>: Put the base material into a 5% sodium hydroxide solution (temperature of 50\u2103, time of 20min) for ultrasonic cleaning to remove surface oil stains and dust. After cleaning, rinse it 3 times with deionized water and then dry it with hot air (80\u2103, 30min) to ensure that the surface water content of the base material is \u22640.1%. Residual oil stains will reduce the bonding force between the copper foil and the base material, and the thick - copper layer is likely to fall off.<\/li><li><strong>Copper - foil Lamination<\/strong>: Use the hot - press lamination process to laminate the 8OZ electrolytic copper foil on both sides of the base material (temperature of 120\u2103, pressure of 20kg\/cm\u00b2, time of 30min). During the lamination process, monitor the pressure uniformity in real - time (pressure deviation \u2264 5%) to avoid bubbles or wrinkles in the copper foil. Due to the large area of the thick - copper foil, bubbles will cause incomplete circuits during subsequent etching.<\/li><\/ul><h4 class=\"header-vfC6AV auto-hide-last-sibling-br\">(2) Circuit Formation: Ensuring Uniform Thick - copper Etching<\/h4><div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">Due to the large thickness of the 8OZ copper foil, the conventional etching process is prone to \"uneven etching\" (the circuit edges are serrated), and the etching parameters need to be optimized. The specific steps are as follows:<\/div><div class=\"container-utlnW2 md-box-line-break wrapper-d0Cc1k undefined\">\u00a0<\/div><ul class=\"auto-hide-last-sibling-br\"><li><strong>Dry - film Lamination<\/strong>: Select a 50\u03bcm - thick high - temperature - resistant dry - film (the conventional dry - film thickness is 35\u03bcm, and the thick dry - film can cover the unevenness of the thick - copper surface). Laminate it onto the copper - foil surface using a hot - press roller (temperature of 90\u2103, pressure of 0.8kg\/cm\u00b2, speed of 1m\/min). After lamination, use a vacuum laminator to remove the bubbles under the dry - film (vacuum degree \u2264 10Pa).<\/li><li><strong>Exposure<\/strong>: Use an ultraviolet exposure machine (exposure energy of 150 - 200mJ\/cm\u00b2, while it is 80 - 120mJ\/cm\u00b2 for conventional double - sided PCBs) and extend the exposure time to ensure the full curing of the thick dry - film. If the thick dry - film is not fully cured, it is likely to fall off during development, resulting in etching errors.<\/li><li><strong>Development<\/strong>: Develop with a 1.5% sodium carbonate solution (temperature of 32\u2103, spray pressure of 2.0kg\/cm\u00b2) for 90s (the conventional time is 60s) to ensure the complete removal of the unexposed dry - film. After development, rinse it with deionized water to avoid the influence of residual liquid on etching.<\/li><li><strong>Etching<\/strong>: Adopt the \"segmented etching\" process. First, use a 15% ferric chloride solution (temperature of 55\u2103, spray pressure of 2.5kg\/cm\u00b2) to etch 60% of the copper thickness, and then switch to a 10% ferric chloride solution (temperature of 50\u2103, spray pressure of 2.0kg\/cm\u00b2) to etch the remaining 40%. The high - concentration etchant quickly removes most of the copper thickness, and the low - concentration etchant finely trims the circuit edges to reduce under - etching (under - etching amount \u2264 10\u03bcm). After etching, use a 5% hydrochloric acid solution to remove the remaining dry - film, and detect the circuit width through AOI (error \u2264 \u00b115%, while it is \u00b110% for conventional double - sided PCBs. A slightly larger error is allowed for thick - copper circuits).<\/li><\/ul><h4 class=\"header-vfC6AV auto-hide-last-sibling-br\">(3) Via Metallization: Ensuring Inter - layer Interconnection of Thick Copper<\/h4><div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">The vias of an 8OZ double - sided PCB board need to penetrate a 275\u03bcm - thick copper layer, and via metallization is prone to \"discontinuous copper layer on the hole wall\" (resulting in via open - circuits). Hole - wall treatment and the electroless copper - plating process need to be strengthened. The steps are as follows:<\/div><div class=\"container-utlnW2 md-box-line-break wrapper-d0Cc1k undefined\">\u00a0<\/div><ul class=\"auto-hide-last-sibling-br\"><li><strong>Drilling<\/strong>: Drill vias (hole diameter of 0.3 - 1.0mm) with a CNC drilling machine (rotation speed of 25000rpm, feed rate of 40mm\/min). After drilling, blow out the copper slag in the holes with compressed air (pressure of 0.5MPa). Copper slag is likely to be generated and block the holes during the drilling of the thick - copper layer, affecting the subsequent electroless copper plating.<\/li><li><strong>Hole - wall Treatment<\/strong>:<ul class=\"auto-hide-last-sibling-br\"><li><strong>Alkaline Degreasing<\/strong>: Use a 5% sodium hydroxide solution (50\u2103, 15min) to remove the oil stains and resin powder on the hole wall.<\/li><li><strong>Plasma Cleaning<\/strong>: Activate the hole wall with oxygen plasma (power of 600W, time of 8min) to improve the adhesion of electroless copper plating. The large surface area of the thick - copper hole wall requires sufficient activation to prevent the electroless copper - plating layer from falling off.<\/li><li><strong>Micro - etching<\/strong>: Slightly etch the copper layer on the hole wall with a 10% ammonium persulfate solution (45\u2103, 8min) to remove the oxide layer and expose a fresh copper surface.<\/li><\/ul><\/li><li><strong>Electroless Copper Plating and Electro - plating Copper<\/strong>:<ul class=\"auto-hide-last-sibling-br\"><li><strong>Electroless Copper Plating<\/strong>: Use a copper sulfate solution (temperature of 48\u2103, pH value of 12.5, time of 30min) to form a 1.0 - 1.5\u03bcm - thick copper layer on the hole wall (0.5\u03bcm for conventional double - sided PCBs), ensuring no copper leakage on the hole wall.<\/li><li><strong>Electro - plating Copper<\/strong>: Use an acidic copper sulfate plating solution (temperature of 28\u2103, current density of 2.0A\/dm\u00b2, time of 120min) to increase the copper thickness on the hole wall to over 30\u03bcm. The thick - copper vias need a sufficient copper thickness to carry large currents and avoid via heating. During the electro - plating process, stir the plating solution regularly to prevent uneven plating in the holes.<\/li><\/ul><\/li><\/ul><h4 class=\"header-vfC6AV auto-hide-last-sibling-br\">(4) Surface Treatment and Shape Processing<\/h4><ul class=\"auto-hide-last-sibling-br\"><li><strong>Solder - mask Ink Printing<\/strong>: Use screen - printing to print the high - temperature - resistant solder - mask ink on the substrate surface (thickness of 25 - 30\u03bcm) to cover the non - soldering areas. After printing, pre - bake it (80\u2103, 30min), then expose it to ultraviolet light (energy of 180mJ\/cm\u00b2), develop it (with a 1.2% sodium carbonate solution), and finally bake it at 150\u2103 for 60min for curing. Since thick - copper circuits dissipate heat quickly, the solder - mask ink needs to have good high - temperature resistance to avoid ink falling off at high temperatures.<\/li><li><strong>Surface Treatment<\/strong>: Electro - plate nickel - gold (nickel layer of 8 - 10\u03bcm, gold layer of 1 - 3\u03bcm) or tin - plate (tin layer of 5 - 8\u03bcm) in the soldering area, and coat OSP (Organic Solderability Preservative) in the non - soldering area. After surface treatment, test the coating adhesion (cross - cut test \u2265 4B level) to ensure that the coating does not fall off in large - current scenarios.<\/li><li><strong>Shape Processing<\/strong>: Process according to the design size using a CNC punching machine (for simple shapes) or laser cutting (for complex shapes), with a cutting accuracy of \u00b10.05mm and edge burrs \u2264 0.02mm. After processing, chamfer the fixing holes (such as screw holes) (45\u00b0, depth of 0.1mm) to avoid scratching the bolts during installation.<\/li><\/ul><h4 class=\"header-vfC6AV auto-hide-last-sibling-br\">(5) Finished - product Inspection: Ensuring Large - current Reliability<\/h4><div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">The inspection of an 8OZ double - sided PCB board should focus on \"current - carrying capacity\" and \"heat - dissipation performance\". The core inspection items are as follows:<\/div><div class=\"container-utlnW2 md-box-line-break wrapper-d0Cc1k undefined\">\u00a0<\/div><ul class=\"auto-hide-last-sibling-br\"><li><strong>Electrical Performance Testing<\/strong>: Use ICT in - circuit testing to check for open - circuits and short - circuits. Use a flying - probe tester to test via impedance (\u22645m\u03a9) and line resistance (according to the line length, for example, the resistance of a 100mm - long and 2mm - wide line is \u226450m\u03a9). Conduct a withstand - voltage test (1000V AC, 1min without breakdown) to prevent electric leakage in large - current scenarios.<\/li><li><strong>Large - current Testing<\/strong>: Pass the designed current (such as 50A) for 1h and monitor the line temperature rise (\u226430\u2103, with an ambient temperature of 25\u2103) to avoid the overheating and burning of the circuit. If there are etching defects in the thick - copper circuit (such as the thinning of the circuit), it will cause the local resistance to increase and the temperature rise to exceed the standard.<\/li><li><strong>Environmental Reliability Testing<\/strong>: Conduct a thermal - shock test (-40\u2103\/30min\u2192125\u2103\/30min, 100 cycles) to test the inter - layer bonding force (peel strength \u2265 1.2N\/mm), and a damp - heat test (85\u2103\/85% RH, 500h) to test the insulation resistance (\u226510\u00b9\u2070\u03a9), ensuring stable operation in harsh environments.<\/li><\/ul><h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">III. Key Technical Difficulties and Solutions<\/h3><div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">The manufacturing of an 8OZ double - sided PCB board has three core difficulties: \"uneven thick - copper etching\", \"low via - metallization reliability\", and \"substrate warping\", which need to be overcome one by one through process optimization:<\/div><h4 class=\"header-vfC6AV auto-hide-last-sibling-br\">(1) Uneven Thick - copper Etching: Segmented Etching + Real - time Monitoring<\/h4><ul class=\"auto-hide-last-sibling-br\"><li><strong>Difficulty<\/strong>: Due to the large thickness of the 8OZ copper foil, it is difficult for the etchant to penetrate uniformly during etching, and the circuit edges are prone to serration (under - etching amount exceeds 15\u03bcm), affecting the current - carrying capacity.<\/li><li><strong>Solution<\/strong>: Adopt the \"segmented etching\" process (high - concentration fast etching + low - concentration fine etching), and install an on - line monitoring camera in the etching machine to observe the state of the circuit edges in real - time. Dynamically adjust the concentration of the etchant and the spray pressure (for example, when the under - etching amount is too large, reduce the etchant concentration to 8% and increase the spray pressure to 2.8kg\/cm\u00b2) to ensure that the under - etching amount is \u226410\u03bcm.<\/li><\/ul><h4 class=\"header-vfC6AV auto-hide-last-sibling-br\">(2) Low Via - metallization Reliability: Strengthening Hole - wall Treatment + Thick Electroless Copper - plating Layer<\/h4><ul class=\"auto-hide-last-sibling-br\"><li><strong>Difficulty<\/strong>: The large hole - wall area of thick - copper vias and the possible gaps at the junction of the copper foil and the base material make it easy to have \"broken copper layer on the hole wall\" during electroless copper plating, resulting in via open - circuits.<\/li><\/ul>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-6ba9aacd elementor-widget elementor-widget-wd_image_or_svg\" data-id=\"6ba9aacd\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"wd_image_or_svg.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\n\t\t<div class=\"wd-image text-left\">\n\t\t\t\t\t\t\t\t<img decoding=\"async\" width=\"664\" height=\"500\" src=\"https:\/\/ulpcb.com\/wp-content\/uploads\/2025\/09\/8-OZ-PCB-2.webp\" class=\"attachment-full size-full\" alt=\"An 8OZ PCB board (with a copper - foil thickness of approximately 275\u03bcm, as 1OZ\u224835\u03bcm) is a large - current - carrying printed circuit board. Its core processes are designed around &quot;thick - copper processing&quot; and &quot;current stability&quot;. High - Tg FR - 4 (Tg\u2265170\u2103) is selected as the base material to meet the heat - dissipation requirements of thick copper\" srcset=\"https:\/\/ulpcb.com\/wp-content\/uploads\/2025\/09\/8-OZ-PCB-2.webp 664w, https:\/\/ulpcb.com\/wp-content\/uploads\/2025\/09\/8-OZ-PCB-2-300x226.webp 300w, https:\/\/ulpcb.com\/wp-content\/uploads\/2025\/09\/8-OZ-PCB-2-16x12.webp 16w\" sizes=\"(max-width: 664px) 100vw, 664px\" \/>\t\t\t\t\t<\/div>\n\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>","protected":false},"excerpt":{"rendered":"<p>Home\u9875\u9762 8OZ 2L PCB n 8OZ PCB board (with a copper &#8211; foil thickness of approximately 275\u03bcm, as 1OZ\u224835\u03bcm) is<\/p>","protected":false},"author":1,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"footnotes":""},"class_list":["post-1194","page","type-page","status-publish","hentry"],"_links":{"self":[{"href":"https:\/\/ulpcb.com\/sk\/wp-json\/wp\/v2\/pages\/1194","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/ulpcb.com\/sk\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/ulpcb.com\/sk\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/ulpcb.com\/sk\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/ulpcb.com\/sk\/wp-json\/wp\/v2\/comments?post=1194"}],"version-history":[{"count":7,"href":"https:\/\/ulpcb.com\/sk\/wp-json\/wp\/v2\/pages\/1194\/revisions"}],"predecessor-version":[{"id":1432,"href":"https:\/\/ulpcb.com\/sk\/wp-json\/wp\/v2\/pages\/1194\/revisions\/1432"}],"wp:attachment":[{"href":"https:\/\/ulpcb.com\/sk\/wp-json\/wp\/v2\/media?parent=1194"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}