{"id":1180,"date":"2025-09-27T17:23:25","date_gmt":"2025-09-27T09:23:25","guid":{"rendered":"https:\/\/ulpcb.com\/?page_id=1180"},"modified":"2025-09-28T20:49:36","modified_gmt":"2025-09-28T12:49:36","slug":"4-layer-copper-substrate-2","status":"publish","type":"page","link":"https:\/\/ulpcb.com\/sk\/4-layer-copper-substrate-2\/","title":{"rendered":"4-Layer Copper Substrate"},"content":{"rendered":"<div data-elementor-type=\"wp-page\" data-elementor-id=\"1180\" class=\"elementor elementor-1180\">\n\t\t\t\t<div class=\"wd-negative-gap elementor-element elementor-element-7e04672d e-flex e-con-boxed e-con e-parent\" data-id=\"7e04672d\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t\t\t<div class=\"elementor-element elementor-element-12c87ba8 wd-el-breadcrumbs text-left elementor-widget elementor-widget-wd_element_breadcrumbs\" data-id=\"12c87ba8\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"wd_element_breadcrumbs.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<nav class=\"wd-breadcrumbs\"><a href=\"https:\/\/ulpcb.com\/sk\/\">Home<\/a><span class=\"wd-delimiter\"><\/span><span class=\"wd-last\">Str\u00e1nka<\/span><\/nav>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"wd-negative-gap elementor-element elementor-element-2e5ed7a8 e-flex e-con-boxed e-con e-parent\" data-id=\"2e5ed7a8\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t<div class=\"elementor-element elementor-element-45e6b229 e-con-full e-flex e-con e-child\" data-id=\"45e6b229\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-6da68622 wd-width-100 elementor-widget elementor-widget-wd_images_gallery\" data-id=\"6da68622\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"wd_images_gallery.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"wd-images-gallery photoswipe-images wd-carousel-container\" style=\"--wd-align-items:center; --wd-justify-content:center;\">\n\t\t\t\t\t\t\t<div class=\"wd-carousel-inner\">\n\t\t\t\t\t\t<div class=\"wd-carousel wd-grid\" data-wrap=\"yes\" style=\"--wd-col-lg:1;--wd-col-md:1;--wd-col-sm:1;--wd-gap-lg:0px;\">\n\t\t\t\t\t\t\t\t\t<div class=\"wd-carousel-wrap\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<div class=\"wd-gallery-item wd-carousel-item\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t<a  href=\"https:\/\/ulpcb.com\/wp-content\/uploads\/2025\/09\/4-Layer-Copper-Substrate.webp\" data-width=\"640\" data-height=\"640\" data-index=\"1\" data-elementor-open-lightbox=\"no\">\n\t\t\t\t\t\t\n\t\t\t\t\t\t<img fetchpriority=\"high\" decoding=\"async\" width=\"600\" height=\"600\" src=\"https:\/\/ulpcb.com\/wp-content\/uploads\/2025\/09\/4-Layer-Copper-Substrate-600x600.webp\" class=\"attachment-600x600 size-600x600\" alt=\"The structure of a four - layer copper - based circuit board needs to balance the complexity of electrical connections and the efficiency of heat transfer. A typical lamination scheme (from top to bottom) is the top - layer copper conductor layer \u2192 insulating and heat - conducting layer \u2192 middle copper conductor layer \u2192 insulating and heat - conducting layer \u2192 bottom - layer copper conductor layer. Some high - end products add a &quot;shielding copper layer&quot;, forming a &quot;five - layer structure&quot; (including the shielding layer).\" srcset=\"https:\/\/ulpcb.com\/wp-content\/uploads\/2025\/09\/4-Layer-Copper-Substrate-600x600.webp 600w, https:\/\/ulpcb.com\/wp-content\/uploads\/2025\/09\/4-Layer-Copper-Substrate-300x300.webp 300w, https:\/\/ulpcb.com\/wp-content\/uploads\/2025\/09\/4-Layer-Copper-Substrate-150x150.webp 150w, https:\/\/ulpcb.com\/wp-content\/uploads\/2025\/09\/4-Layer-Copper-Substrate-12x12.webp 12w, https:\/\/ulpcb.com\/wp-content\/uploads\/2025\/09\/4-Layer-Copper-Substrate.webp 640w\" sizes=\"(max-width: 600px) 100vw, 600px\" \/>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<\/a>\n\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<div class=\"wd-nav-arrows wd-pos-sep wd-hover-1 wd-icon-1\">\n\t\t\t<div class=\"wd-btn-arrow wd-prev wd-disabled\">\n\t\t\t\t<div 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elementor-element-1b62a259 elementor-widget elementor-widget-wd_text_block\" data-id=\"1b62a259\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"wd_text_block.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"wd-text-block reset-last-child text-left\">\n\t\t\t\n\t\t\t<h2 class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\"><span style=\"vertical-align: inherit;\"><span style=\"vertical-align: inherit;\">\u56db\u5c42\u94dc\u57fa\u7535\u8def\u677f\u662f\u4e00\u79cd\u5177\u6709\u9ad8\u6548\u6563\u70ed\u548c\u590d\u6742\u5e03\u7ebf\u80fd\u529b\u7684\u5370\u5237\u7535\u8def\u677f\u3002\u5176\u6838\u5fc3\u7ed3\u6784\u662f\u201c\u94dc\u5bfc\u7535\u5c42+\u7edd\u7f18\u5bfc\u70ed\u5c42\u201d\u7684\u4ea4\u66ff\u5806\u53e0\uff08\u603b\u5171\u56db\u5c42\u529f\u80fd\u5c42\uff09\u3002\u9876\u5c42\u548c\u5e95\u5c42\u7684\u94dc\u7b94\uff0818-70\u03bcm\uff09\u7528\u4e8e\u710a\u63a5\u529f\u7387\u5668\u4ef6\u548c\u4f20\u8f93\u4fe1\u53f7\u3002\u4e2d\u95f4\u7684\u94dc\u5c42\u53ef\u4ee5\u5b9e\u73b0\u7535\u8def\u4e92\u8fde\u6216\u5c4f\u853d\u3002\u7edd\u7f18\u5c42\u4e3b\u8981\u4f7f\u7528\u9676\u74f7\u586b\u5145\u6811\u8102\uff08\u5bfc\u70ed\u7cfb\u6570\u4e3a1-5W\/m\u00b7K\uff09\uff0c\u4ee5\u786e\u4fdd\u5feb\u901f\u6563\u70ed\u3002<\/span><\/span><\/h2><h2 class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\"><span style=\"vertical-align: inherit;\"><span style=\"vertical-align: inherit;\">\u5b83\u7ed3\u5408\u4e86\u9ad8\u5bc6\u5ea6\u5e03\u7ebf\uff08\u652f\u6301\u591a\u73af\u8def\u7535\u8def\u8bbe\u8ba1\uff09\u548c\u5f3a\u5927\u7684\u6563\u70ed\u80fd\u529b\uff08\u6563\u70ed\u6548\u7387\u6bd4\u53cc\u5c42\u94dc\u57fa\u7535\u8def\u677f\u63d0\u9ad830%\u4ee5\u4e0a\uff09\u3002\u5b83\u5e7f\u6cdb\u5e94\u7528\u4e8eLED\u7167\u660e\u3001\u6c7d\u8f66\u7535\u6e90\u6a21\u5757\u548c\u5de5\u4e1a\u7535\u6e90\u7b49\u573a\u666f\u3002\u5b83\u80fd\u6709\u6548\u89e3\u51b3\u9ad8\u529f\u7387\u5668\u4ef6\u7684\u6563\u70ed\u79ef\u805a\u95ee\u9898\uff0c\u63d0\u9ad8\u8bbe\u5907\u7684\u7a33\u5b9a\u6027\u548c\u4f7f\u7528\u5bff\u547d\u3002<\/span><\/span><\/h2>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-768fef00 e-con-full e-flex e-con e-child\" data-id=\"768fef00\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-42f22b5c 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M\u1edf m\u1ee5c b\u1eb1ng ph\u00edm Enter ho\u1eb7c Space, \u0111\u00f3ng b\u1eb1ng ph\u00edm Esc v\u00e0 di chuy\u1ec3n b\u1eb1ng c\u00e1c ph\u00edm m\u0169i t\u00ean.\" data-no-translation-aria-label=\"\">\n\t\t\t<div class=\"e-n-tabs-heading\" role=\"tablist\">\n\t\t\t\t\t<button id=\"e-n-tab-title-3457898631\" data-tab-title-id=\"e-n-tab-title-3457898631\" class=\"e-n-tab-title\" aria-selected=\"true\" data-tab-index=\"1\" role=\"tab\" tabindex=\"0\" aria-controls=\"e-n-tab-content-3457898631\" style=\"--n-tabs-title-order: 1;\">\n\t\t\t\t\t\t<span class=\"e-n-tab-title-text\">\n\t\t\t\tDescription\t\t\t<\/span>\n\t\t<\/button>\n\t\t\t\t\t<\/div>\n\t\t\t<div class=\"e-n-tabs-content\">\n\t\t\t\t<div id=\"e-n-tab-content-3457898631\" role=\"tabpanel\" aria-labelledby=\"e-n-tab-title-3457898631\" data-tab-index=\"1\" style=\"--n-tabs-title-order: 1;\" class=\"e-active elementor-element elementor-element-6057e691 e-con-full e-flex e-con e-child\" data-id=\"6057e691\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t<div class=\"wd-negative-gap elementor-element elementor-element-5b33a13a e-flex e-con-boxed e-con e-child\" data-id=\"5b33a13a\" data-element_type=\"container\" data-e-type=\"container\" data-settings=\"{&quot;background_background&quot;:&quot;classic&quot;}\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t\t\t<div class=\"elementor-element elementor-element-197b7ec7 elementor-widget elementor-widget-wd_text_block\" data-id=\"197b7ec7\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"wd_text_block.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"wd-text-block reset-last-child text-left\">\n\t\t\t\n\t\t\t<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">I. Core Process Flow: Step - by - step Realization from Base Material to Finished Product<\/h3><div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">The production of four - layer copper - based circuit boards needs to focus on two goals: \"copper - layer conduction\" and \"stability of the insulating and heat - conducting layer\". The process proceeds in the order of \"base - material preparation \u2192 lamination \u2192 drilling and via metallization \u2192 circuit formation \u2192 surface treatment \u2192 shape processing\". Each step requires strict matching of material properties and process parameters.<\/div><h4 class=\"header-vfC6AV auto-hide-last-sibling-br\">(1) Base - material Preparation: Laying the Foundation for Heat - dissipation and Conductivity<\/h4><div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">The choice of base materials directly determines the core performance of four - layer copper - based circuit boards. Copper foils and insulating and heat - conducting base materials need to be prepared separately and pre - treated.<\/div><div class=\"container-utlnW2 md-box-line-break wrapper-d0Cc1k undefined\">\u00a0<\/div><ul class=\"auto-hide-last-sibling-br\"><li><strong>Copper Foil Selection and Treatment<\/strong>: Select electrolytic copper foils with a purity of \u226599.9% (common thicknesses are 18\u03bcm, 35\u03bcm, 70\u03bcm). The top - layer and bottom - layer copper foils should meet the soldering requirements of power devices (preferably with a thickness of 35\u03bcm or more), and the two middle - layer copper foils focus on circuit interconnection (18\u03bcm thin copper foils can be selected). In the pre - treatment stage, through \"degreasing cleaning (removing surface oil stains) \u2192 pickling (5% sulfuric acid solution to remove the oxide layer) \u2192 passivation treatment (forming a nano - level protective film)\", ensure that the surface roughness of the copper foil Ra \u2264 1.5\u03bcm to improve the bonding force with the insulating layer.<\/li><li><strong>Insulating and Heat - conducting Base - material Preparation<\/strong>: Corely use ceramic - filled epoxy resin base materials (thermal conductivity of 1 - 5W\/m\u00b7K, suitable for medium - to - high - power scenarios) or aluminum nitride ceramic base materials (thermal conductivity of 150 - 200W\/m\u00b7K for high - end heat - dissipation requirements). Cut the base material to the designed size (with an error of \u00b10.1mm), and through \"plasma cleaning (removing surface impurities) \u2192 pre - heating (80\u2103 for 30min to remove internal moisture)\", avoid bubbles in subsequent lamination.<\/li><\/ul><h4 class=\"header-vfC6AV auto-hide-last-sibling-br\">(2) Lamination: Integrating the Four - layer Structure<\/h4><div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">Lamination is a key process to form the alternating structure of \"copper layer - insulating layer - copper layer\", and the problem of \"mismatch of thermal expansion coefficients of different materials\" needs to be solved. First, stack in a clean room (Class 1000) in the order of \"bottom - layer copper foil \u2192 insulating and heat - conducting base material \u2192 middle copper foil \u2192 insulating and heat - conducting base material \u2192 top - layer copper foil\", and lay a \"bonding film\" (modified epoxy resin, thickness of 0.05 - 0.1mm) between each layer. Then, send it to a vacuum laminator and adopt a \"step - by - step temperature - increasing and pressure - increasing\" process:<\/div><div class=\"container-utlnW2 md-box-line-break wrapper-d0Cc1k undefined\">\u00a0<\/div><ul class=\"auto-hide-last-sibling-br\"><li><strong>Pre - heating Stage<\/strong>: From 60\u2103 to 100\u2103, with a heating rate of 5\u2103\/min, a pressure of 5kg\/cm\u00b2, and keep warm for 20min to remove the air between layers.<\/li><li><strong>Curing Stage<\/strong>: From 100\u2103 to 160\u2103, with a heating rate of 3\u2103\/min, a pressure of 20 - 25kg\/cm\u00b2, and keep warm for 60min to ensure that the bonding film is completely cured.<\/li><li><strong>Cooling Stage<\/strong>: Naturally cool to room temperature (with a cooling rate of \u22644\u2103\/min) to prevent internal stress in the base material due to temperature differences. After lamination, test the inter - layer bonding force (peel strength \u2265 1.2N\/mm) to ensure there are no delamination or bubble defects.<\/li><\/ul><h4 class=\"header-vfC6AV auto-hide-last-sibling-br\">(3) Drilling and Via Metallization: Establishing Inter - layer Electrical Interconnection<\/h4><div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">Four - layer copper - based circuit boards need to achieve the conduction of each copper layer through drilling and via metallization. The process is divided into four steps: \"drilling \u2192 hole - wall treatment \u2192 electroless copper plating \u2192 electro - plating copper\".<\/div><div class=\"container-utlnW2 md-box-line-break wrapper-d0Cc1k undefined\">\u00a0<\/div><ul class=\"auto-hide-last-sibling-br\"><li><strong>Drilling<\/strong>: According to design requirements, use a CNC drilling machine to drill \"through - holes\" (hole diameter 0.3 - 0.8mm, suitable for through - hole components) and \"blind holes\" (hole diameter 0.1 - 0.3mm for local layer interconnection). The drilling accuracy needs to be controlled within \u00b10.02mm, and the hole - wall roughness Ra \u2264 2.5\u03bcm to avoid burrs affecting subsequent metallization.<\/li><li><strong>Hole - wall Treatment<\/strong>: Through \"alkaline degreasing (removing drilling oil stains) \u2192 acidic etching (removing resin burrs on the hole wall) \u2192 plasma cleaning (activating the hole - wall surface to improve the adhesion of electroless copper plating)\", ensure that the hole wall is clean and free of impurities.<\/li><li><strong>Electroless Copper Plating and Electro - plating Copper<\/strong>: First, use the electroless copper - plating process (copper sulfate solution, at 45\u2103 for 20min) to form a 0.5 - 1\u03bcm thick conductive layer on the hole wall. Then, through electro - plating copper (nickel sulfate plating solution, with a current density of 2A\/dm\u00b2 for 60min), increase the copper thickness on the hole wall to 20 - 30\u03bcm, ensuring that the hole resistance \u2264 5m\u03a9 to meet the current - transmission requirements.<\/li><\/ul><h4 class=\"header-vfC6AV auto-hide-last-sibling-br\">(4) Circuit Formation: Precision Fabrication of Conductive Circuits<\/h4><div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">Circuit formation needs to pattern the copper layer through \"dry - film exposure \u2192 development \u2192 etching\", with the core being to ensure circuit accuracy and edge smoothness.<\/div><div class=\"container-utlnW2 md-box-line-break wrapper-d0Cc1k undefined\">\u00a0<\/div><ul class=\"auto-hide-last-sibling-br\"><li><strong>Dry - film Lamination<\/strong>: Laminate the photosensitive dry - film (thickness of 25 - 35\u03bcm) onto the substrate surface through hot - pressing (at 80\u2103 with a pressure of 0.5kg\/cm\u00b2) to ensure there are no bubbles or wrinkles.<\/li><li><strong>Exposure and Development<\/strong>: Use an ultraviolet exposure machine (exposure energy of 80 - 120mJ\/cm\u00b2) to expose according to the circuit film pattern, and then develop with a sodium carbonate solution (1% concentration, at 30\u2103) to remove the unexposed dry - film, exposing the copper layer to be etched.<\/li><li><strong>Etching<\/strong>: Use a ferric chloride solution (concentration of 400g\/L, at 50\u2103) to etch the exposed copper layer. Control the etching rate at 2\u03bcm\/min to ensure there is no under - etching at the circuit edges (under - etching amount \u2264 5\u03bcm), and control the line - width error within \u00b110% (for example, if the designed line - width is 0.2mm, the actual error should be \u2264 \u00b10.02mm). After etching, peel off the remaining dry - film and use AOI (Automated Optical Inspection) to check for open - circuits, short - circuits, line - width deviations, etc.<\/li><\/ul><h4 class=\"header-vfC6AV auto-hide-last-sibling-br\">(5) Surface Treatment and Shape Processing: Improving Practicality and Adaptability<\/h4><ul class=\"auto-hide-last-sibling-br\"><li><strong>Surface Treatment<\/strong>: Select different processes according to application scenarios. Use \"gold - plating\" (gold thickness of 1 - 3\u03bcm, nickel thickness of 5 - 8\u03bcm to improve soldering reliability) for the soldering area, and use \"solder - mask ink printing\" (epoxy resin solder - mask, thickness of 20 - 30\u03bcm for insulation and anti - oxidation) for non - soldering areas. After printing, cure at 150\u2103 for 60min to ensure adhesion (cross - cut test \u2265 4B level).<\/li><li><strong>Shape Processing<\/strong>: Use a CNC punching machine (for simple shapes) or laser cutting (for complex shapes) to process according to the designed size. Control the cutting accuracy within \u00b10.05mm, and ensure there are no burrs at the edges (burr height \u2264 0.02mm). If mounting holes are required, drill again and perform \"hole - mouth chamfering\" (45\u00b0 angle, 0.1mm depth) to avoid sharp corners scratching components.<\/li><\/ul><h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">II. Key Technical Difficulties: Breaking through the Synergy Bottleneck of Performance and Process<\/h3><div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">There are three core technical difficulties in the production of four - layer copper - based circuit boards, which need to be solved one by one through process optimization:<\/div><div class=\"container-utlnW2 md-box-line-break wrapper-d0Cc1k undefined\">\u00a0<\/div><ul class=\"auto-hide-last-sibling-br\"><li><strong>Bonding Stability between the Insulating and Heat - conducting Layer and the Copper Foil<\/strong>: The thermal expansion coefficients of the insulating layer (such as ceramic - filled resin) and the copper foil are quite different (the thermal expansion coefficient of resin is about 30ppm\/\u2103, and that of copper is about 17ppm\/\u2103), and delamination is likely to occur during lamination. It is necessary to \"pre - treat the copper - foil surface (increase roughness) + optimize the bonding - film formula (introduce flexible modifiers) + control the laminating cooling rate\" to improve the inter - layer bonding force. Also, there should be no delamination after the high - and low - temperature cycling test (-40\u2103 to 125\u2103, 100 cycles).<\/li><li><strong>Reliability of Via Metallization<\/strong>: The drilling depth of the four - layer structure is large (50% more than that of double - layer boards), and resin burrs or impurities are likely to appear on the hole wall, resulting in the breakage of the electroless copper - plating layer. It is necessary to introduce \"plasma cleaning + acidic etching\" double hole - wall treatment, and optimize the electroless copper - plating process parameters (such as extending the electroless copper - plating time to 25min) to ensure that the copper layer on the hole wall is continuous without breakpoints. After the \"thermal shock test\" (260\u2103 for 10s, 3 times), there should be no significant change in the hole resistance.<\/li><li><strong>Precision Control of Circuit Etching<\/strong>: The middle copper foil is thin (such as 18\u03bcm), and over - etching is likely to occur during etching, making the circuit thin and weak. It is necessary to adopt \"low - concentration etchant (ferric chloride concentration of 350g\/L) + slow etching rate (1.5\u03bcm\/min) + real - time monitoring of etching time\", combined with LDI (Laser - direct Imaging) technology (exposure accuracy of \u00b15\u03bcm) to ensure the integrity of fine - line - width (such as 0.1mm) circuits.<\/li><\/ul><h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">III. Quality - control System: Ensuring Product Performance throughout the Process<\/h3><div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">Four - layer copper - based circuit boards need to establish a quality - control system covering \"raw materials - processes - finished products\":<\/div><div class=\"container-utlnW2 md-box-line-break wrapper-d0Cc1k undefined\">\u00a0<\/div><ul class=\"auto-hide-last-sibling-br\"><li><strong>Raw - material Inspection<\/strong>: Test the purity, tensile strength (\u2265250MPa), and elongation (\u226510%) of copper foils; test the thermal conductivity (error \u2264 10%) and temperature resistance (no deformation at 260\u2103) of insulating base materials.<\/li><li><strong>Process Inspection<\/strong>: After lamination, test the inter - layer bonding force and bubbles; after via metallization, use X - Ray to test the copper - layer thickness on the hole wall; after circuit formation, the AOI inspection qualification rate should be \u226599.5%.<\/li><li><strong>Finished - product Inspection<\/strong>: Include electrical - performance testing (insulation resistance \u2265 10\u00b9\u2070\u03a9, withstand voltage \u2265 500V AC), heat - dissipation performance testing (thermal resistance \u2264 0.5\u2103\/W), and mechanical - performance testing (flexural strength \u2265 150MPa) to ensure that the finished products meet IPC - 4101 (base - material standard) and IPC - 6012 (circuit - board standard).<\/li><\/ul>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-181788e5 elementor-widget elementor-widget-wd_image_or_svg\" data-id=\"181788e5\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"wd_image_or_svg.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\n\t\t<div class=\"wd-image text-left\">\n\t\t\t\t\t\t\t\t<img decoding=\"async\" width=\"640\" height=\"640\" src=\"https:\/\/ulpcb.com\/wp-content\/uploads\/2025\/09\/4-Layer-Copper-Substrate.webp\" class=\"attachment-full size-full\" alt=\"The structure of a four - layer copper - based circuit board needs to balance the complexity of electrical connections and the efficiency of heat transfer. A typical lamination scheme (from top to bottom) is the top - layer copper conductor layer \u2192 insulating and heat - conducting layer \u2192 middle copper conductor layer \u2192 insulating and heat - conducting layer \u2192 bottom - layer copper conductor layer. Some high - end products add a &quot;shielding copper layer&quot;, forming a &quot;five - layer structure&quot; (including the shielding layer).\" srcset=\"https:\/\/ulpcb.com\/wp-content\/uploads\/2025\/09\/4-Layer-Copper-Substrate.webp 640w, https:\/\/ulpcb.com\/wp-content\/uploads\/2025\/09\/4-Layer-Copper-Substrate-300x300.webp 300w, https:\/\/ulpcb.com\/wp-content\/uploads\/2025\/09\/4-Layer-Copper-Substrate-150x150.webp 150w, https:\/\/ulpcb.com\/wp-content\/uploads\/2025\/09\/4-Layer-Copper-Substrate-12x12.webp 12w, https:\/\/ulpcb.com\/wp-content\/uploads\/2025\/09\/4-Layer-Copper-Substrate-600x600.webp 600w\" sizes=\"(max-width: 640px) 100vw, 640px\" \/>\t\t\t\t\t<\/div>\n\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>","protected":false},"excerpt":{"rendered":"<p>Home\u9875\u9762 HDI PCB \u56db\u5c42\u94dc\u57fa\u7535\u8def\u677f\u662f\u4e00\u79cd\u5177\u6709\u9ad8\u6548\u6563\u70ed\u548c\u590d\u6742\u5e03\u7ebf\u80fd\u529b\u7684\u5370\u5237\u7535\u8def\u677f\u3002\u5176\u6838\u5fc3\u7ed3\u6784\u662f\u201c\u94dc\u5bfc\u7535\u5c42+\u7edd\u7f18\u5bfc\u70ed\u5c42\u201d\u7684\u4ea4\u66ff\u5806\u53e0\uff08\u603b\u5171\u56db\u5c42\u529f\u80fd\u5c42\uff09\u3002\u9876\u5c42\u548c\u5e95\u5c42\u7684\u94dc\u7b94\uff0818-70\u03bcm\uff09\u7528\u4e8e\u710a\u63a5\u529f\u7387\u5668\u4ef6\u548c\u4f20\u8f93\u4fe1\u53f7\u3002\u4e2d\u95f4\u7684\u94dc\u5c42\u53ef\u4ee5\u5b9e\u73b0\u7535\u8def\u4e92\u8fde\u6216\u5c4f\u853d\u3002\u7edd\u7f18\u5c42\u4e3b\u8981\u4f7f\u7528\u9676\u74f7\u586b\u5145\u6811\u8102\uff08\u5bfc\u70ed\u7cfb\u6570\u4e3a1-5W\/m\u00b7K\uff09\uff0c\u4ee5\u786e\u4fdd\u5feb\u901f\u6563\u70ed\u3002 \u5b83\u7ed3\u5408\u4e86\u9ad8\u5bc6\u5ea6\u5e03\u7ebf\uff08\u652f\u6301\u591a\u73af\u8def\u7535\u8def\u8bbe\u8ba1\uff09\u548c\u5f3a\u5927\u7684\u6563\u70ed\u80fd\u529b\uff08\u6563\u70ed\u6548\u7387\u6bd4\u53cc\u5c42\u94dc\u57fa\u7535\u8def\u677f\u63d0\u9ad830%\u4ee5\u4e0a\uff09\u3002\u5b83\u5e7f\u6cdb\u5e94\u7528\u4e8eLED\u7167\u660e\u3001\u6c7d\u8f66\u7535\u6e90\u6a21\u5757\u548c\u5de5\u4e1a\u7535\u6e90\u7b49\u573a\u666f\u3002\u5b83\u80fd\u6709\u6548\u89e3\u51b3\u9ad8\u529f\u7387\u5668\u4ef6\u7684\u6563\u70ed\u79ef\u805a\u95ee\u9898\uff0c\u63d0\u9ad8\u8bbe\u5907\u7684\u7a33\u5b9a\u6027\u548c\u4f7f\u7528\u5bff\u547d\u3002 Get a Quote Get a Quote Get A quote NameEmailEnter enquiry subjectYour MessageSubmit Mail us<\/p>","protected":false},"author":1,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"footnotes":""},"class_list":["post-1180","page","type-page","status-publish","hentry"],"_links":{"self":[{"href":"https:\/\/ulpcb.com\/sk\/wp-json\/wp\/v2\/pages\/1180","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/ulpcb.com\/sk\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/ulpcb.com\/sk\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/ulpcb.com\/sk\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/ulpcb.com\/sk\/wp-json\/wp\/v2\/comments?post=1180"}],"version-history":[{"count":7,"href":"https:\/\/ulpcb.com\/sk\/wp-json\/wp\/v2\/pages\/1180\/revisions"}],"predecessor-version":[{"id":1418,"href":"https:\/\/ulpcb.com\/sk\/wp-json\/wp\/v2\/pages\/1180\/revisions\/1418"}],"wp:attachment":[{"href":"https:\/\/ulpcb.com\/sk\/wp-json\/wp\/v2\/media?parent=1180"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}