{"id":49,"date":"2025-08-17T10:23:23","date_gmt":"2025-08-17T02:23:23","guid":{"rendered":"https:\/\/ulpcb.com\/?page_id=49"},"modified":"2025-09-27T23:26:19","modified_gmt":"2025-09-27T15:26:19","slug":"heavy-copper-pcb","status":"publish","type":"page","link":"https:\/\/ulpcb.com\/ms\/pcb-product\/heavy-copper-pcb\/","title":{"rendered":"Heavy Copper PCB"},"content":{"rendered":"<div data-elementor-type=\"wp-page\" data-elementor-id=\"49\" class=\"elementor elementor-49\">\n\t\t\t\t<div class=\"wd-negative-gap elementor-element elementor-element-d933095 e-flex e-con-boxed e-con e-parent\" data-id=\"d933095\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t\t\t<div class=\"elementor-element elementor-element-d73d829 wd-el-breadcrumbs text-left elementor-widget elementor-widget-wd_element_breadcrumbs\" data-id=\"d73d829\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"wd_element_breadcrumbs.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<nav class=\"wd-breadcrumbs\"><a href=\"https:\/\/ulpcb.com\/ms\/\">Home<\/a><span class=\"wd-delimiter\"><\/span><span class=\"wd-last\">Halaman<\/span><\/nav>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-a797269 elementor-widget elementor-widget-heading\" data-id=\"a797269\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t\t<h1 class=\"elementor-heading-title elementor-size-default\">Heavy Copper PCB<\/h1>\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"wd-negative-gap elementor-element elementor-element-670cd4d e-flex e-con-boxed e-con e-parent\" data-id=\"670cd4d\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t<div class=\"elementor-element elementor-element-5b7747c e-con-full e-flex e-con e-child\" data-id=\"5b7747c\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-1f34b44 wd-width-100 elementor-widget elementor-widget-wd_images_gallery\" data-id=\"1f34b44\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"wd_images_gallery.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"wd-images-gallery photoswipe-images wd-carousel-container\" style=\"--wd-align-items:center; --wd-justify-content:center;\">\n\t\t\t\t\t\t\t<div class=\"wd-carousel-inner\">\n\t\t\t\t\t\t<div class=\"wd-carousel wd-grid\" data-wrap=\"yes\" style=\"--wd-col-lg:1;--wd-col-md:1;--wd-col-sm:1;--wd-gap-lg:0px;\">\n\t\t\t\t\t\t\t\t\t<div class=\"wd-carousel-wrap\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<div class=\"wd-gallery-item wd-carousel-item\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t<a  href=\"https:\/\/ulpcb.com\/wp-content\/uploads\/2025\/09\/A-power-supply-4OZ-thick-copper-PCB-board.webp\" data-width=\"666\" data-height=\"500\" data-index=\"1\" data-elementor-open-lightbox=\"no\">\n\t\t\t\t\t\t\n\t\t\t\t\t\t<img fetchpriority=\"high\" decoding=\"async\" width=\"600\" height=\"400\" src=\"https:\/\/ulpcb.com\/wp-content\/uploads\/2025\/09\/A-power-supply-4OZ-thick-copper-PCB-board-600x400.webp\" class=\"attachment-600x400 size-600x400\" alt=\"A power supply 4OZ thick - copper PCB board\" srcset=\"https:\/\/ulpcb.com\/wp-content\/uploads\/2025\/09\/A-power-supply-4OZ-thick-copper-PCB-board-600x400.webp 600w, https:\/\/ulpcb.com\/wp-content\/uploads\/2025\/09\/A-power-supply-4OZ-thick-copper-PCB-board-16x12.webp 16w\" sizes=\"(max-width: 600px) 100vw, 600px\" \/>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<\/a>\n\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<div class=\"wd-nav-arrows wd-pos-sep wd-hover-1 wd-icon-1\">\n\t\t\t<div class=\"wd-btn-arrow wd-prev wd-disabled\">\n\t\t\t\t<div class=\"wd-arrow-inner\"><\/div>\n\t\t\t<\/div>\n\t\t\t<div class=\"wd-btn-arrow wd-next\">\n\t\t\t\t<div class=\"wd-arrow-inner\"><\/div>\n\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t\t\n\t\t\t\t<\/div>\n\n\t\t\t\t\t\t<div class=\"wd-nav-pagin-wrap text-center wd-style-shape wd-hide-md-sm wd-hide-sm\">\n\t\t\t<ul class=\"wd-nav-pagin\"><\/ul>\n\t\t<\/div>\n\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-f281fd6 e-con-full e-flex e-con e-child\" data-id=\"f281fd6\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-32bbf6c elementor-widget elementor-widget-wd_text_block\" data-id=\"32bbf6c\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"wd_text_block.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"wd-text-block reset-last-child text-left\">\n\t\t\t\n\t\t\t<h2>A 4 - layer power thick - copper board has a core structure of \"2 signal layers + 2 thick - copper power\/ground layers\". The thickness of the thick - copper layers reaches 70 - 140\u03bcm (much thicker than the conventional 1oz\/35\u03bcm), increasing the current - carrying capacity by 3 - 5 times. It is suitable for large - current scenarios above 10A. High - Tg FR - 4 base material (Tg\u2265170\u2103) is used. During lamination, step - by - step temperature control is applied to reduce the stress of thick copper. Pulse electro - plating is used for via metallization to ensure a uniform copper layer on the hole wall. It is widely used in new - energy vehicle OBCs, industrial power supplies, and server power - supply modules, which can reduce current loss and improve the stability and heat - dissipation efficiency of the power system<\/h2>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-c0208aa e-con-full e-flex e-con e-child\" data-id=\"c0208aa\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-32bf858 elementor-widget elementor-widget-wd_popup\" data-id=\"32bf858\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"wd_popup.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div class=\"wd-button-wrapper text-left\" >\n\t\t\t<a class=\"btn btn-style-default btn-shape-rectangle btn-size-default wd-open-popup btn-color-primary btn-icon-pos-right\"  href=\"#quote\">\n\t\t\t\t<span class=\"wd-btn-text\" 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class=\"e-con-inner\">\n\t\t\t\t<div class=\"elementor-element elementor-element-dabca59 e-n-tabs-none elementor-widget elementor-widget-n-tabs\" data-id=\"dabca59\" data-element_type=\"widget\" data-e-type=\"widget\" data-settings=\"{&quot;horizontal_scroll_mobile&quot;:&quot;enable&quot;,&quot;horizontal_scroll&quot;:&quot;disable&quot;}\" data-widget_type=\"nested-tabs.default\">\n\t\t\t\t\t\t\t<div class=\"e-n-tabs\" data-widget-number=\"229362265\" aria-label=\"Tabs. Open items with Enter or Space, close with Escape and navigate using the Arrow keys.\" data-no-translation-aria-label=\"\">\n\t\t\t<div class=\"e-n-tabs-heading\" role=\"tablist\">\n\t\t\t\t\t<button id=\"e-n-tab-title-2293622651\" data-tab-title-id=\"e-n-tab-title-2293622651\" class=\"e-n-tab-title\" aria-selected=\"true\" data-tab-index=\"1\" role=\"tab\" tabindex=\"0\" aria-controls=\"e-n-tab-content-2293622651\" style=\"--n-tabs-title-order: 1;\">\n\t\t\t\t\t\t<span class=\"e-n-tab-title-text\">\n\t\t\t\tDescription\t\t\t<\/span>\n\t\t<\/button>\n\t\t\t\t\t<\/div>\n\t\t\t<div class=\"e-n-tabs-content\">\n\t\t\t\t<div id=\"e-n-tab-content-2293622651\" role=\"tabpanel\" aria-labelledby=\"e-n-tab-title-2293622651\" data-tab-index=\"1\" style=\"--n-tabs-title-order: 1;\" class=\"e-active elementor-element elementor-element-67beadb e-con-full e-flex e-con e-child\" data-id=\"67beadb\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t<div class=\"wd-negative-gap elementor-element elementor-element-564475d e-flex e-con-boxed e-con e-child\" data-id=\"564475d\" data-element_type=\"container\" data-e-type=\"container\" data-settings=\"{&quot;background_background&quot;:&quot;classic&quot;}\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t\t\t<div class=\"elementor-element elementor-element-e03e95a elementor-widget elementor-widget-wd_text_block\" data-id=\"e03e95a\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"wd_text_block.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"wd-text-block reset-last-child text-left\">\n\t\t\t\n\t\t\t<div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">A 4 - layer 4OZ power thick - copper board has a core structure of \"2 signal layers + 2 4OZ thick - copper power\/ground layers\". The single - side copper thickness reaches 140\u03bcm (far exceeding the conventional 1OZ\/35\u03bcm), and its current - carrying capacity can reach over 30A. It is the core carrier for new - energy vehicle OBCs and industrial power modules. However, the differences in physical properties between the thick - copper layer and the base material pose multiple challenges during the manufacturing process, such as insufficient lamination resin filling and out - of - control etching precision. This article, combined with industry practical experience, disassembles the complete manufacturing process and analyzes four core difficulties and their solutions.<\/div><h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">I. Customized Manufacturing Process: 8 Key Steps from Base Material to Finished Product<\/h3><div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">The 4 - layer 4OZ power thick - copper board requires special steps like thick - copper pretreatment and step - by - step electro - plating based on the conventional PCB process. The full - process cycle is about 12 - 15 days, and leading enterprises can stabilize the yield above 85%.<\/div><div class=\"container-utlnW2 md-box-line-break wrapper-d0Cc1k undefined\">\u00a0<\/div><ol class=\"auto-hide-last-sibling-br\"><li><strong>Base - material Selection and Pretreatment<\/strong><div class=\"container-utlnW2 md-box-line-break wrapper-d0Cc1k undefined\">\u00a0<\/div>Select high - Tg (\u2265170\u2103), low - CTE (Z - direction \u2264 35ppm\/\u2103) FR - 4 base material, and match it with 4OZ high - purity electrolytic copper foil (copper content \u2265 99.98%) to ensure temperature resistance and current - carrying capacity. After cutting, first conduct ultrasonic cleaning (40\u2103 neutral cleaning agent), and then pre - bake at 150\u2103 for 2 hours to reduce the water absorption rate of the base material to \u22640.04%, avoiding lamination bubbles. Especially, the surface of the copper foil needs to be micro - etched to form a rough surface with Ra1.2\u03bcm, enhancing the bonding force with the resin.<\/li><li><strong>Inner - layer Thick - copper Circuit Manufacturing<\/strong><div class=\"container-utlnW2 md-box-line-break wrapper-d0Cc1k undefined\">\u00a0<\/div>The inner layer (power\/ground layer) adopts the process of \"pattern transfer - etching compensation - secondary inspection\": Coat a high - temperature - resistant photosensitive film (thickness of 25\u03bcm), and form patterns through LDI laser exposure (accuracy of \u00b11\u03bcm). During etching, use the \"multiple rapid - etching method\", conduct acidic etching three times (copper chloride concentration of 200g\/L), and rinse with clear water after each etching to control the under - etching amount within 12\u03bcm, which is usually 25\u03bcm. After etching, double - check with AOI and a metallographic microscope to ensure the line - width deviation is \u2264\u00b15\u03bcm.<\/li><li><strong>Lamination Assembly and Precise Pressing<\/strong><div class=\"container-utlnW2 md-box-line-break wrapper-d0Cc1k undefined\">\u00a0<\/div>The stacking order is \"outer 1OZ copper foil \u2192 1080 prepreg (2 pieces) \u2192 inner 4OZ thick - copper layer \u2192 106 prepreg (1 piece) \u2192 inner 4OZ thick - copper layer \u2192 1080 prepreg (2 pieces) \u2192 outer 1OZ copper foil\". To solve the problem of resin filling in thick - copper gaps, select high - fluidity prepreg with a resin content of 65%, and add copper - laying blocks in copper - free areas to increase the residual copper rate and reduce the filling pressure. The lamination uses a step - by - step temperature - control program: 80\u2103\/10kg\/cm\u00b2 (30min) for exhaust \u2192 150\u2103\/25kg\/cm\u00b2 (40min) for resin flow \u2192 180\u2103\/30kg\/cm\u00b2 (90min) for curing, extending the high - temperature stage by 30 minutes compared to the conventional process to ensure complete resin cross - linking.<\/li><li><strong>High - precision Drilling and Desmear<\/strong><div class=\"container-utlnW2 md-box-line-break wrapper-d0Cc1k undefined\">\u00a0<\/div>Use a CNC drilling machine (rotation speed of 80000r\/min) to process through - holes and blind holes, controlling the aperture deviation within \u00b10.01mm. After drilling, use the plasma desmear process (O\u2082\/CF\u2084 mixed gas) to remove the resin residue and carbonized layer on the hole wall, avoiding poor bonding of the hole wall in thick - copper areas. For small holes with a diameter \u2264 0.3mm, adopt the \"laser pre - drilling + mechanical fine - drilling\" composite process to prevent drill breakage and hole - position deviation.<\/li><li><strong>Step - by - step Electro - plating for Thick - hole Copper<\/strong><div class=\"container-utlnW2 md-box-line-break wrapper-d0Cc1k undefined\">\u00a0<\/div>Via metallization is the core of the power - board reliability. Adopt the \"copper - deposition - three - time electro - plating\" process: First, electroless copper - plating to form a 1\u03bcm thin copper layer. The first electro - plating (current density of 1A\/dm\u00b2) increases the copper thickness on the hole wall to 20\u03bcm. The second time, open windows with a dry - film to electro - plate the areas that need to be plugged separately, making the copper thickness on the hole wall reach over 35\u03bcm. The third time, electro - plate the whole board for thickening. Finally, the surface copper thickness reaches 140\u03bcm, and the copper thickness on the hole wall is \u2265 38\u03bcm. During electro - plating, monitor the solution temperature (25\u00b12\u2103) and pH value (10\u00b10.5) in real - time to avoid uneven thick - copper deposition.<\/li><li><strong>Outer - layer Circuit and Impedance Control<\/strong><div class=\"container-utlnW2 md-box-line-break wrapper-d0Cc1k undefined\">\u00a0<\/div>The outer - layer signal layer adopts the process of \"pattern transfer - etching - impedance calibration\". The line - width offsets the under - etching effect through etching compensation (increasing the design value by 10\u03bcm). Use a TDR time - domain reflectometer to detect the impedance online, controlling the 50\u03a9 single - ended impedance tolerance within \u00b15%. For the pad areas connected to the thick - copper layer, reserve a 0.2mm transition area to reduce the heating problem caused by current mutation.<\/li><li><strong>Step - by - step Solder - mask Printing<\/strong><div class=\"container-utlnW2 md-box-line-break wrapper-d0Cc1k undefined\">\u00a0<\/div>Due to the 50 - 80\u03bcm height difference between the thick - copper circuits and the base material, two - time solder - mask printing is required: The first time, fill and level the gaps in the thick - copper area (film thickness of 40\u03bcm), and cure at 150\u2103 for 30 minutes. The second time, print the solder - mask ink on the whole board (thickness of 20\u03bcm), ensuring the surface flatness is \u2264 15\u03bcm. The solder - mask curing needs to be heated in stages to avoid ink cracking caused by thermal - stress concentration in the thick - copper area.<\/li><li><strong>Surface Treatment and Finished - product Inspection<\/strong><div class=\"container-utlnW2 md-box-line-break wrapper-d0Cc1k undefined\">\u00a0<\/div>The pads are treated with gold - plating (2\u03bcm gold layer, 5\u03bcm nickel layer), and the non - pad areas are coated with OSP for anti - oxidation. The finished product needs to pass three core tests: Electrical performance (flying - probe test for open - circuits and short - circuits, insulation resistance \u2265 10\u00b9\u2070\u03a9), thermal reliability (-40\u2103~125\u2103 cycle for 1000 times, no delamination), and current - carrying test (applying 30A current for 1 hour, temperature rise \u2264 50K). Randomly select 5% of the samples from each batch for metallographic sectioning to check the inter - layer bonding and the copper thickness on the hole wall.<\/li><\/ol><h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">II. Four Core Difficulties and Breakthrough Solutions<\/h3><ol class=\"auto-hide-last-sibling-br\"><li><strong>Insufficient Lamination Resin Filling and Layer Misalignment<\/strong><ul class=\"auto-hide-last-sibling-br\"><li><strong>Difficulty<\/strong>: The gaps between 4OZ thick - copper circuits reach 80 - 100\u03bcm. The resin flow of conventional prepreg is insufficient, easily forming voids. The CTE difference between copper and the base material is large (copper 17ppm\/\u2103, resin 35ppm\/\u2103), and layer misalignment of \u2265 20\u03bcm is likely to occur during lamination.<\/li><li><strong>Solution<\/strong>: Stack 3 pieces of 1080 prepreg for resin filling, increasing the resin content to 65%. Before lamination, add rivets to the edge of the core board for fixation, and achieve an alignment accuracy of \u00b12\u03bcm through the CCD optical positioning system. Set misalignment targets at the board edge, and after lamination, detect the layer misalignment with X - ray. Rework the boards that exceed the tolerance.<\/li><\/ul><\/li><li><strong>Out - of - control Thick - copper Etching Precision<\/strong><ul class=\"auto-hide-last-sibling-br\"><li><strong>Difficulty<\/strong>: During the etching of 140\u03bcm thick copper, it is difficult to exchange the etching solution. The under - etching amount can reach 30\u03bcm, resulting in a line - width deviation exceeding \u00b115\u03bcm, and even \"incomplete etching\" residues may occur.<\/li><li><strong>Solution<\/strong>: Use a \"high - pressure spray + segmented etching\" device, increase the spray pressure to 3kg\/cm\u00b2, and control the etchant temperature at 45\u00b11\u2103. Set dynamic etching compensation through CAM software, adjust the compensation coefficient (0.1 - 0.15mm) according to the line width. Check the line width every 50 boards and adjust the etching rate in real - time.<\/li><\/ul><\/li><li><strong>Electro - plating Concavity of Thick - hole Copper and Exposed Base Material at the Hole Mouth<\/strong><ul class=\"auto-hide-last-sibling-br\"><li><strong>Difficulty<\/strong>: During deep - hole electro - plating, the current distribution is uneven. The copper thickness at the hole center is only 60% of that at the hole mouth. After plugging and grinding, the copper layer at the hole mouth is easily worn through, resulting in exposed base material.<\/li><li><strong>Solution<\/strong>: Use a pulse electro - plating power supply (frequency of 20kHz) to improve the current distribution, reducing the copper - thickness difference between the hole center and the hole mouth to within 20%. Pre - plate and thicken the hole mouth of the holes that need to be plugged by 5\u03bcm. When grinding, use a fine - grit grinding wheel (800# mesh) to control the grinding amount within \u2264 5\u03bcm. Select high - temperature - resistant plugging resin with a hardness of \u2265 80D after curing.<\/li><\/ul><\/li><li><strong>Reliability Failure Caused by Thick - copper Thermal Stress<\/strong><ul class=\"auto-hide-last-sibling-br\"><li><strong>Difficulty<\/strong>: When the power board is working, the temperature of the thick - copper layer can reach over 100\u2103. The stress generated by thermal expansion is likely to cause inter - layer delamination and hole - copper fracture.<\/li><li><strong>Solution<\/strong>: Select a base material with a matched CTE (filler content \u2265 60%), controlling the CTE difference between the copper layer and the base material within 10ppm\/\u2103. After lamination, conduct an annealing treatment at 180\u2103 for 4 hours to release internal stress. Design a heat - dissipation hole array in the thick - copper area to reduce the working temperature rise and extend the service life.<\/li><\/ul><\/li><\/ol>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-7978c39 elementor-widget elementor-widget-wd_image_or_svg\" data-id=\"7978c39\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"wd_image_or_svg.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\n\t\t<div class=\"wd-image text-left\">\n\t\t\t\t\t\t\t\t<img decoding=\"async\" width=\"666\" height=\"500\" src=\"https:\/\/ulpcb.com\/wp-content\/uploads\/2025\/09\/A-power-supply-4OZ-thick-copper-PCB-board.webp\" class=\"attachment-full size-full\" alt=\"A power supply 4OZ thick - copper PCB board\" srcset=\"https:\/\/ulpcb.com\/wp-content\/uploads\/2025\/09\/A-power-supply-4OZ-thick-copper-PCB-board.webp 666w, https:\/\/ulpcb.com\/wp-content\/uploads\/2025\/09\/A-power-supply-4OZ-thick-copper-PCB-board-300x225.webp 300w, https:\/\/ulpcb.com\/wp-content\/uploads\/2025\/09\/A-power-supply-4OZ-thick-copper-PCB-board-16x12.webp 16w\" sizes=\"(max-width: 666px) 100vw, 666px\" \/>\t\t\t\t\t<\/div>\n\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>","protected":false},"excerpt":{"rendered":"<p>Home\u9875\u9762 Heavy Copper PCB A 4 &#8211; layer power thick &#8211; copper board has a core structure of &#8220;2 signal<\/p>","protected":false},"author":1,"featured_media":0,"parent":15,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"footnotes":""},"class_list":["post-49","page","type-page","status-publish","hentry"],"_links":{"self":[{"href":"https:\/\/ulpcb.com\/ms\/wp-json\/wp\/v2\/pages\/49","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/ulpcb.com\/ms\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/ulpcb.com\/ms\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/ulpcb.com\/ms\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/ulpcb.com\/ms\/wp-json\/wp\/v2\/comments?post=49"}],"version-history":[{"count":13,"href":"https:\/\/ulpcb.com\/ms\/wp-json\/wp\/v2\/pages\/49\/revisions"}],"predecessor-version":[{"id":1239,"href":"https:\/\/ulpcb.com\/ms\/wp-json\/wp\/v2\/pages\/49\/revisions\/1239"}],"up":[{"embeddable":true,"href":"https:\/\/ulpcb.com\/ms\/wp-json\/wp\/v2\/pages\/15"}],"wp:attachment":[{"href":"https:\/\/ulpcb.com\/ms\/wp-json\/wp\/v2\/media?parent=49"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}