{"id":472,"date":"2025-08-25T09:53:15","date_gmt":"2025-08-25T01:53:15","guid":{"rendered":"https:\/\/ulpcb.com\/?page_id=472"},"modified":"2025-08-31T23:44:26","modified_gmt":"2025-08-31T15:44:26","slug":"equipment-e","status":"publish","type":"page","link":"https:\/\/ulpcb.com\/ko\/pcb-equipment\/equipment-e\/","title":{"rendered":"Equipment E"},"content":{"rendered":"<div data-elementor-type=\"wp-page\" data-elementor-id=\"472\" class=\"elementor elementor-472\">\n\t\t\t\t<div class=\"wd-negative-gap elementor-element elementor-element-e281174 e-flex e-con-boxed e-con e-parent\" data-id=\"e281174\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t\t\t<div class=\"elementor-element elementor-element-a39264b wd-el-breadcrumbs text-left elementor-widget elementor-widget-wd_element_breadcrumbs\" data-id=\"a39264b\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"wd_element_breadcrumbs.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<nav class=\"wd-breadcrumbs\"><a href=\"https:\/\/ulpcb.com\/ko\/\">Home<\/a><span class=\"wd-delimiter\"><\/span><span class=\"wd-last\">\ud398\uc774\uc9c0<\/span><\/nav>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"wd-negative-gap elementor-element elementor-element-4d5c619 e-flex e-con-boxed e-con e-parent\" data-id=\"4d5c619\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t<div class=\"elementor-element elementor-element-93d713f e-con-full e-flex e-con e-child\" data-id=\"93d713f\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-40c83f3 wd-width-100 elementor-widget elementor-widget-wd_images_gallery\" data-id=\"40c83f3\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"wd_images_gallery.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"wd-images-gallery photoswipe-images wd-carousel-container\" style=\"--wd-align-items:center; --wd-justify-content:center;\">\n\t\t\t\t\t\t\t<div class=\"wd-carousel-inner\">\n\t\t\t\t\t\t<div class=\"wd-carousel wd-grid\" data-wrap=\"yes\" style=\"--wd-col-lg:1;--wd-col-md:1;--wd-col-sm:1;--wd-gap-lg:0px;\">\n\t\t\t\t\t\t\t\t\t<div class=\"wd-carousel-wrap\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<div class=\"wd-gallery-item wd-carousel-item\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t<a  href=\"https:\/\/ulpcb.com\/wp-content\/uploads\/2025\/08\/LDI-exposure-machine-scaled.jpg\" data-width=\"2560\" data-height=\"1920\" data-index=\"1\" data-elementor-open-lightbox=\"no\">\n\t\t\t\t\t\t\n\t\t\t\t\t\t<img fetchpriority=\"high\" decoding=\"async\" width=\"600\" height=\"400\" src=\"https:\/\/ulpcb.com\/wp-content\/uploads\/2025\/08\/LDI-exposure-machine-scaled-600x400.jpg\" class=\"attachment-600x400 size-600x400\" alt=\"The LDI exposure machine mainly exposes the circuit onto the FR4 substrate\" srcset=\"https:\/\/ulpcb.com\/wp-content\/uploads\/2025\/08\/LDI-exposure-machine-scaled-600x400.jpg 600w, https:\/\/ulpcb.com\/wp-content\/uploads\/2025\/08\/LDI-exposure-machine-16x12.jpg 16w\" sizes=\"(max-width: 600px) 100vw, 600px\" \/>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<\/a>\n\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<div class=\"wd-nav-arrows wd-pos-sep wd-hover-1 wd-icon-1\">\n\t\t\t<div class=\"wd-btn-arrow wd-prev wd-disabled\">\n\t\t\t\t<div class=\"wd-arrow-inner\"><\/div>\n\t\t\t<\/div>\n\t\t\t<div class=\"wd-btn-arrow wd-next\">\n\t\t\t\t<div class=\"wd-arrow-inner\"><\/div>\n\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t\t\n\t\t\t\t<\/div>\n\n\t\t\t\t\t\t<div class=\"wd-nav-pagin-wrap text-center wd-style-shape wd-hide-md-sm wd-hide-sm\">\n\t\t\t<ul class=\"wd-nav-pagin\"><\/ul>\n\t\t<\/div>\n\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-5e89831 e-con-full e-flex e-con e-child\" data-id=\"5e89831\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-850b233 elementor-widget elementor-widget-heading\" data-id=\"850b233\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t\t<h1 class=\"elementor-heading-title elementor-size-default\">LDI exposure machine<\/h1>\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-88b8cca elementor-widget elementor-widget-wd_text_block\" data-id=\"88b8cca\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"wd_text_block.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"wd-text-block reset-last-child text-left\">\n\t\t\t\n\t\t\t<p>In the field of PCB (Printed Circuit Board) manufacturing, LDI (Laser Direct Imaging) is a core technology that replaces the traditional \"film + exposure\" process. It directly draws circuit patterns on photosensitive materials (such as dry film, solder - resist ink) through laser beams, without relying on physical films. It has advantages like high precision, strong flexibility, and simplified processes, and is a key process in manufacturing high - end PCBs (such as 5G base - station PCBs, automotive PCBs, IC substrates).<\/p>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-b3eb3b7 e-con-full e-flex e-con e-child\" data-id=\"b3eb3b7\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-e40449b elementor-widget elementor-widget-wd_popup\" data-id=\"e40449b\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"wd_popup.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div class=\"wd-button-wrapper text-left\" >\n\t\t\t<a class=\"btn btn-style-default btn-shape-rectangle btn-size-default wd-open-popup btn-color-primary btn-icon-pos-right\"  href=\"#quote\">\n\t\t\t\t<span class=\"wd-btn-text\" 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Open items with Enter or Space, close with Escape and navigate using the Arrow keys.\" data-no-translation-aria-label=\"\">\n\t\t\t<div class=\"e-n-tabs-heading\" role=\"tablist\">\n\t\t\t\t\t<button id=\"e-n-tab-title-2274988431\" data-tab-title-id=\"e-n-tab-title-2274988431\" class=\"e-n-tab-title\" aria-selected=\"true\" data-tab-index=\"1\" role=\"tab\" tabindex=\"0\" aria-controls=\"e-n-tab-content-2274988431\" style=\"--n-tabs-title-order: 1;\">\n\t\t\t\t\t\t<span class=\"e-n-tab-title-text\">\n\t\t\t\tDatasheet\t\t\t<\/span>\n\t\t<\/button>\n\t\t\t\t\t<\/div>\n\t\t\t<div class=\"e-n-tabs-content\">\n\t\t\t\t<div id=\"e-n-tab-content-2274988431\" role=\"tabpanel\" aria-labelledby=\"e-n-tab-title-2274988431\" data-tab-index=\"1\" style=\"--n-tabs-title-order: 1;\" class=\"e-active elementor-element elementor-element-8159eb9 e-con-full e-flex e-con e-child\" data-id=\"8159eb9\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t<div class=\"wd-negative-gap elementor-element elementor-element-cbfcf48 e-flex e-con-boxed e-con e-child\" data-id=\"cbfcf48\" data-element_type=\"container\" data-e-type=\"container\" data-settings=\"{&quot;background_background&quot;:&quot;classic&quot;}\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t\t\t<div class=\"elementor-element elementor-element-1d34b0a elementor-widget elementor-widget-wd_text_block\" data-id=\"1d34b0a\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"wd_text_block.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"wd-text-block reset-last-child text-left\">\n\t\t\t\n\t\t\t<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">I. Core Components of LDI Exposure Machine: 5 Key Systems<\/h3><div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">The functionality of the LDI exposure machine depends on the coordinated operation of \"laser generation - pattern control - precise scanning - stable support - quality monitoring\". Its core systems can be broken down into the following 5 parts, each with a clear division of labor and mutual cooperation:<\/div><p>\u00a0<\/p><div class=\"auto-hide-last-sibling-br mdbox-table-root table-container-GhL7Lo\" data-scroll-inline-overflow=\"true\" data-scroll-inline-at-start=\"true\" data-scroll-inline-start-overflow=\"false\" data-scroll-inline-at-end=\"false\" data-scroll-inline-end-overflow=\"true\"><div class=\"table-scroll-container-hgHkfW mdbox-table-scroll-container\"><table><thead><tr><th>System Name<\/th><th>Core Components<\/th><th>Main Functions<\/th><\/tr><\/thead><tbody><tr><td>Laser Generation System<\/td><td>Laser generator (mainly in the ultraviolet band, such as 355nm\/405nm), laser energy stabilizer<\/td><td>Generates high - energy and high - stability laser beams that meet the requirements of photosensitive materials. 355nm laser is suitable for dry film, 405nm laser is suitable for solder - resist ink. The energy stabilizer ensures that the laser power fluctuation is \u2264 \u00b12% (to avoid uneven curing).<\/td><\/tr><tr><td>Pattern Control System<\/td><td>Digital signal processor (DSP), acousto - optic \/ electro - optic modulator<\/td><td>Receives the Gerber file of the PCB design and converts it into pixel - based control signals. The modulator \"switches\" the laser beam in real - time to accurately match the \"illuminated \/ non - illuminated\" areas of the pattern, ensuring no pattern distortion.<\/td><\/tr><tr><td>Optical Scanning System<\/td><td>Galvanometer (X\/Y - axis dual galvanometers), f - \u03b8 lens, focusing lens<\/td><td>\"Focuses + guides\" the laser beam. The galvanometer controls the scanning direction of the laser beam (with a response speed of \u03bcs level). The f - \u03b8 lens ensures that the laser spot size is consistent across the entire scanning area of the PCB (to avoid edge spot distortion). The focusing lens compresses the laser into a tiny spot of 5 - 10\u03bcm (suitable for fine circuits).<\/td><\/tr><tr><td>Workbench System<\/td><td>High - precision motion platform (driven by linear motors), vacuum adsorption device<\/td><td>Supports the PCB board and enables precise movement. The linear motor drive ensures a platform positioning accuracy of \u00b11\u03bcm (suitable for multi - layer board alignment requirements). The vacuum adsorption device firmly fixes the PCB (to prevent board offset during scanning). Some devices support the coordination of \"platform movement + galvanometer scanning\" (covering large - size PCBs).<\/td><\/tr><tr><td>Visual Positioning and Detection System<\/td><td>CCD industrial cameras (multiple cameras in \u8054\u52a8), image algorithm module<\/td><td>1. Positioning: By identifying the fiducial points (Mark points) on the PCB board, it automatically calibrates the relative position between the PCB and the laser scanning area, and the alignment error can be controlled within \u00b12 - 5\u03bcm.<br class=\"container-utlnW2 wrapper-d0Cc1k undefined\" \/>2. Detection: Some high - end models integrate an \"online detection\" function, which can identify pattern defects (such as circuit gaps, window offsets) in real - time after scanning, reducing subsequent rework.<\/td><\/tr><\/tbody><\/table><\/div><\/div><h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">II. Core Technical Parameters of LDI Exposure Machine: Key Indicators Determining Equipment Performance<\/h3><div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">When choosing or evaluating an LDI exposure machine, the following technical parameters should be paid attention to, as they directly affect the imaging accuracy, production efficiency, and application scenarios of the PCB:<\/div><p>\u00a0<\/p><ul class=\"auto-hide-last-sibling-br\"><li><strong>Laser Spot Diameter<\/strong>: A core indicator determining the minimum line - width capability. The spot diameter of mainstream devices is 5 - 10\u03bcm, and high - end models can reach 3 - 5\u03bcm (suitable for ultra - fine circuit requirements such as IC substrates, Mini LED PCBs). The smaller the spot, the thinner the circuits that can be made (e.g., a 5\u03bcm spot can achieve a 20 - 30\u03bcm line - width \/ line - pitch).<\/li><li><strong>Alignment Accuracy<\/strong>: Crucial for the inter - layer alignment of multi - layer PCBs, relying on the visual positioning system. The alignment accuracy of mainstream devices is \u00b12 - 5\u03bcm, and some high - precision models can reach \u00b11 - 2\u03bcm (to avoid inter - layer short - circuits \/ open - circuits in multi - layer boards).<\/li><li><strong>Scanning Speed<\/strong>: Affects production efficiency, usually measured by \"scanning area per hour\" or \"meters per second\". The scanning speed of mainstream devices is 1 - 3m\/s, and multi - beam models (2 - 4 laser heads) can be increased to over 5m\/s (meeting the needs of high - volume PCB production).<\/li><li><strong>PCB - compatible Size<\/strong>: The maximum bearing size of the workbench. Common specifications are 500mm\u00d7600mm, 600mm\u00d7800mm, and some devices support 1200mm\u00d71500mm large - size substrates (suitable for automotive PCBs, server PCBs, etc.).<\/li><li><strong>Laser Energy Stability<\/strong>: Directly affects the curing effect of photosensitive materials, requiring a laser power fluctuation of \u2264 \u00b12% (if the fluctuation is too large, it may cause insufficient curing in some areas, and the pattern may fall off after development).<\/li><\/ul><h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">III. Classification of LDI Exposure Machines: Divided by Application Scenarios<\/h3><div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">According to the different requirements of PCB manufacturing processes (inner - layer, outer - layer, solder - resist), LDI exposure machines can be divided into three categories, with differences in design focus and functional adaptation:<\/div><p>\u00a0<\/p><ul class=\"auto-hide-last-sibling-br\"><li><strong>Inner - layer LDI Exposure Machine<\/strong>: Suitable for the inner - layer core boards of multi - layer PCBs (with a thickness of 0.1 - 0.3mm, prone to deformation). The core feature is \"fixed platform + galvanometer scanning\" (to avoid deformation of thin core boards during movement), and it supports \"positive - film imaging\" (the laser - illuminated area is the circuit area, which is retained after curing). High alignment accuracy is required (\u00b12 - 3\u03bcm) to ensure the alignment of inner - layer and outer - layer boards during subsequent lamination.<\/li><li><strong>Outer - layer LDI Exposure Machine<\/strong>: Used for the production of outer - layer circuits of PCBs (with copper foil on the surface, dry film needs to be covered). It supports the coordination of \"platform movement + galvanometer scanning\" (covering large - size PCBs) and can switch between \"positive - film \/ negative - film imaging\" (in negative - film imaging, the laser - illuminated area is the non - circuit area, which is removed after development). Some models are suitable for thick - copper PCBs (copper thickness &gt; 100\u03bcm), and the \"3D focusing compensation\" is used to solve the problem of uneven spots caused by copper foil bumps.<\/li><li><strong>Solder - resist LDI Exposure Machine<\/strong>: Specifically used for the solder - resist layer (green - oil layer) windowing (exposing pads) of PCBs. It uses a 405nm wavelength laser (matching the photosensitive characteristics of solder - resist ink). High windowing accuracy is required (\u00b15\u03bcm), suitable for micro - pads (such as pads of 0201, 01005 package components). Some models support \"local exposure\" (only scanning the areas that need windowing, improving efficiency).<\/li><\/ul><h3 class=\"header-vfC6AV auto-hide-last-sibling-br\">IV. Typical Operation Process of LDI Exposure Machine<\/h3><div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\">In the actual production of PCBs, the operation of the LDI exposure machine needs to be connected with the previous (film - pasting \/ ink - printing) and subsequent (development) processes. The specific process is as follows:<\/div><p>\u00a0<\/p><ul class=\"auto-hide-last-sibling-br\"><li><strong>Pre - process Preparation<\/strong>: The PCB board undergoes \"cleaning \u2192 film - pasting (dry film) \/ printing solder - resist ink \u2192 pre - baking\" treatment to ensure that the surface photosensitive material is uniform and free of impurities (to avoid affecting laser imaging).<\/li><li><strong>Equipment Calibration<\/strong>: After startup, calibrate the laser energy (detected by an energy meter to ensure it meets the process requirements) and calibrate the CCD camera (to ensure accurate fiducial point recognition).<\/li><li><strong>PCB Loading<\/strong>: Place the processed PCB board on the workbench and start the vacuum adsorption to ensure the board is flat and fixed.<\/li><li><strong>Fiducial Point Positioning<\/strong>: The CCD camera automatically identifies 2 - 4 fiducial points (Mark points) on the PCB board, calculates the deviation between the actual position and the theoretical position of the PCB, and automatically adjusts the workbench position to complete the alignment.<\/li><li><strong>Laser Exposure<\/strong>: Import the corresponding Gerber pattern file, and the device starts laser scanning according to the set parameters (spot diameter, scanning speed, energy) to complete the pattern imaging of the entire PCB board.<\/li><li><strong>Post - exposure Inspection<\/strong>: After exposure, some devices use the vision system to quickly check whether there are obvious pattern defects (such as missed exposure, circuit breaks). If there are no problems, it is sent to the subsequent development process (rinsing off the uncured photosensitive material).<\/li><\/ul>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-5f2be91 elementor-widget elementor-widget-wd_text_block\" data-id=\"5f2be91\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"wd_text_block.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"wd-text-block reset-last-child text-left\">\n\t\t\t\n\t\t\t\n\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-578ae02 elementor-widget elementor-widget-wd_image_or_svg\" data-id=\"578ae02\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"wd_image_or_svg.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\n\t\t<div class=\"wd-image text-left\">\n\t\t\t\t\t\t\t\t<img decoding=\"async\" width=\"2560\" height=\"1920\" src=\"https:\/\/ulpcb.com\/wp-content\/uploads\/2025\/08\/LDI-exposure-machine-scaled.jpg\" class=\"attachment-full size-full\" alt=\"The LDI exposure machine mainly exposes the circuit onto the FR4 substrate\" srcset=\"https:\/\/ulpcb.com\/wp-content\/uploads\/2025\/08\/LDI-exposure-machine-scaled.jpg 2560w, https:\/\/ulpcb.com\/wp-content\/uploads\/2025\/08\/LDI-exposure-machine-300x225.jpg 300w, https:\/\/ulpcb.com\/wp-content\/uploads\/2025\/08\/LDI-exposure-machine-1024x768.jpg 1024w, https:\/\/ulpcb.com\/wp-content\/uploads\/2025\/08\/LDI-exposure-machine-768x576.jpg 768w, https:\/\/ulpcb.com\/wp-content\/uploads\/2025\/08\/LDI-exposure-machine-1536x1152.jpg 1536w, https:\/\/ulpcb.com\/wp-content\/uploads\/2025\/08\/LDI-exposure-machine-2048x1536.jpg 2048w, https:\/\/ulpcb.com\/wp-content\/uploads\/2025\/08\/LDI-exposure-machine-16x12.jpg 16w\" sizes=\"(max-width: 2560px) 100vw, 2560px\" \/>\t\t\t\t\t<\/div>\n\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>","protected":false},"excerpt":{"rendered":"<p>Home\u9875\u9762 LDI exposure machine In the field of PCB (Printed Circuit Board) manufacturing, LDI (Laser Direct Imaging) is a core<\/p>","protected":false},"author":1,"featured_media":0,"parent":33,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"footnotes":""},"class_list":["post-472","page","type-page","status-publish","hentry"],"_links":{"self":[{"href":"https:\/\/ulpcb.com\/ko\/wp-json\/wp\/v2\/pages\/472","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/ulpcb.com\/ko\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/ulpcb.com\/ko\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/ulpcb.com\/ko\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/ulpcb.com\/ko\/wp-json\/wp\/v2\/comments?post=472"}],"version-history":[{"count":7,"href":"https:\/\/ulpcb.com\/ko\/wp-json\/wp\/v2\/pages\/472\/revisions"}],"predecessor-version":[{"id":895,"href":"https:\/\/ulpcb.com\/ko\/wp-json\/wp\/v2\/pages\/472\/revisions\/895"}],"up":[{"embeddable":true,"href":"https:\/\/ulpcb.com\/ko\/wp-json\/wp\/v2\/pages\/33"}],"wp:attachment":[{"href":"https:\/\/ulpcb.com\/ko\/wp-json\/wp\/v2\/media?parent=472"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}