{"id":37,"date":"2025-08-17T10:22:16","date_gmt":"2025-08-17T02:22:16","guid":{"rendered":"https:\/\/ulpcb.com\/?page_id=37"},"modified":"2025-09-27T23:46:03","modified_gmt":"2025-09-27T15:46:03","slug":"special-pcb","status":"publish","type":"page","link":"https:\/\/ulpcb.com\/de\/pcb-product\/special-pcb\/","title":{"rendered":"Special PCB"},"content":{"rendered":"<div data-elementor-type=\"wp-page\" data-elementor-id=\"37\" class=\"elementor elementor-37\">\n\t\t\t\t<div class=\"wd-negative-gap elementor-element elementor-element-ff4f85f e-flex e-con-boxed e-con e-parent\" data-id=\"ff4f85f\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t\t\t<div class=\"elementor-element elementor-element-4aa9c40 wd-el-breadcrumbs text-left elementor-widget elementor-widget-wd_element_breadcrumbs\" data-id=\"4aa9c40\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"wd_element_breadcrumbs.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<nav class=\"wd-breadcrumbs\"><a href=\"https:\/\/ulpcb.com\/de\/\">Home<\/a><span class=\"wd-delimiter\"><\/span><span class=\"wd-last\">Seite<\/span><\/nav>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"wd-negative-gap elementor-element elementor-element-bab557c e-flex e-con-boxed e-con e-parent\" data-id=\"bab557c\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t<div class=\"elementor-element elementor-element-0dd8254 e-con-full e-flex e-con e-child\" data-id=\"0dd8254\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-ab26fa3 wd-width-100 elementor-widget elementor-widget-wd_images_gallery\" data-id=\"ab26fa3\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"wd_images_gallery.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"wd-images-gallery photoswipe-images wd-carousel-container\" style=\"--wd-align-items:center; --wd-justify-content:center;\">\n\t\t\t\t\t\t\t<div class=\"wd-carousel-inner\">\n\t\t\t\t\t\t<div class=\"wd-carousel wd-grid\" data-wrap=\"yes\" style=\"--wd-col-lg:1;--wd-col-md:1;--wd-col-sm:1;--wd-gap-lg:0px;\">\n\t\t\t\t\t\t\t\t\t<div class=\"wd-carousel-wrap\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<div class=\"wd-gallery-item wd-carousel-item\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t<a  href=\"https:\/\/ulpcb.com\/wp-content\/uploads\/2025\/09\/0.2MM-PCB.png\" data-width=\"726\" data-height=\"582\" data-index=\"1\" data-elementor-open-lightbox=\"no\">\n\t\t\t\t\t\t\n\t\t\t\t\t\t<img fetchpriority=\"high\" decoding=\"async\" width=\"600\" height=\"400\" src=\"https:\/\/ulpcb.com\/wp-content\/uploads\/2025\/09\/0.2MM-PCB-600x400.png\" class=\"attachment-600x400 size-600x400\" alt=\"The 0.2mm - thick rigid PCB (while the thickness of conventional PCBs is mostly 0.8 - 1.6mm), due to its &quot;ultra - thin and lightweight&quot; characteristics, has become the core carrier for smart wearables, micro - sensors, and minimally - invasive medical devices\" \/>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<\/a>\n\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<div class=\"wd-nav-arrows wd-pos-sep wd-hover-1 wd-icon-1\">\n\t\t\t<div class=\"wd-btn-arrow wd-prev wd-disabled\">\n\t\t\t\t<div class=\"wd-arrow-inner\"><\/div>\n\t\t\t<\/div>\n\t\t\t<div class=\"wd-btn-arrow wd-next\">\n\t\t\t\t<div class=\"wd-arrow-inner\"><\/div>\n\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t\t\n\t\t\t\t<\/div>\n\n\t\t\t\t\t\t<div class=\"wd-nav-pagin-wrap text-center wd-style-shape wd-hide-md-sm wd-hide-sm\">\n\t\t\t<ul class=\"wd-nav-pagin\"><\/ul>\n\t\t<\/div>\n\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-b594e02 e-con-full e-flex e-con e-child\" data-id=\"b594e02\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-6dd6ece elementor-widget elementor-widget-heading\" data-id=\"6dd6ece\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t\t<h1 class=\"elementor-heading-title elementor-size-default\">Special PCB<\/h1>\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-e627167 elementor-widget elementor-widget-wd_text_block\" data-id=\"e627167\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"wd_text_block.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"wd-text-block reset-last-child text-left\">\n\t\t\t\n\t\t\t<h2>The 0.2mm - thick rigid PCB (while the thickness of conventional PCBs is mostly 0.8 - 1.6mm), due to its \"ultra - thin and lightweight\" characteristics, has become the core carrier for smart wearables, micro - sensors, and minimally - invasive medical devices. Its manufacturing process needs to overcome three pain points: \"brittle base material, processing deformation, and out - of - control precision\", achieving micron - level manufacturing control through a customized process<\/h2>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-ae02c44 e-con-full e-flex e-con e-child\" data-id=\"ae02c44\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-0a55208 elementor-widget elementor-widget-wd_popup\" data-id=\"0a55208\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"wd_popup.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div class=\"wd-button-wrapper text-left\" >\n\t\t\t<a class=\"btn btn-style-default btn-shape-rectangle btn-size-default wd-open-popup btn-color-primary btn-icon-pos-right\"  href=\"#quote\">\n\t\t\t\t<span class=\"wd-btn-text\" 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400V214.398c22.914 18.251 55.409 43.862 104.938 82.646 21.857 17.205 60.134 55.186 103.062 54.955 42.717.231 80.509-37.199 103.053-54.947 49.528-38.783 82.032-64.401 104.947-82.653V400H48z\"><\/path><\/svg>\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t<\/a>\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-7d39eb5 elementor-widget-divider--view-line elementor-widget elementor-widget-divider\" data-id=\"7d39eb5\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"divider.default\">\n\t\t\t\t\t\t\t<div class=\"elementor-divider\">\n\t\t\t<span class=\"elementor-divider-separator\">\n\t\t\t\t\t\t<\/span>\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"wd-negative-gap elementor-element elementor-element-8ae9bfc e-flex e-con-boxed e-con e-parent\" data-id=\"8ae9bfc\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t\t\t<div class=\"elementor-element elementor-element-b8330c4 e-n-tabs-none elementor-widget elementor-widget-n-tabs\" data-id=\"b8330c4\" data-element_type=\"widget\" data-e-type=\"widget\" data-settings=\"{&quot;horizontal_scroll_mobile&quot;:&quot;enable&quot;,&quot;horizontal_scroll&quot;:&quot;disable&quot;}\" data-widget_type=\"nested-tabs.default\">\n\t\t\t\t\t\t\t<div class=\"e-n-tabs\" data-widget-number=\"193147076\" aria-label=\"\u9009\u9879\u5361\u3002\u4f7f\u7528 Enter \u6216 Space \u6253\u5f00\u9879\u76ee\uff0c\u4f7f\u7528 ESC \u5173\u95ed\u5e76\u4f7f\u7528\u7bad\u5934\u952e\u5bfc\u822a\u3002\">\n\t\t\t<div class=\"e-n-tabs-heading\" role=\"tablist\">\n\t\t\t\t\t<button id=\"e-n-tab-title-1931470761\" data-tab-title-id=\"e-n-tab-title-1931470761\" class=\"e-n-tab-title\" aria-selected=\"true\" data-tab-index=\"1\" role=\"tab\" tabindex=\"0\" aria-controls=\"e-n-tab-content-1931470761\" style=\"--n-tabs-title-order: 1;\">\n\t\t\t\t\t\t<span class=\"e-n-tab-title-text\">\n\t\t\t\tDescription\t\t\t<\/span>\n\t\t<\/button>\n\t\t\t\t\t<\/div>\n\t\t\t<div class=\"e-n-tabs-content\">\n\t\t\t\t<div id=\"e-n-tab-content-1931470761\" role=\"tabpanel\" aria-labelledby=\"e-n-tab-title-1931470761\" data-tab-index=\"1\" style=\"--n-tabs-title-order: 1;\" class=\"e-active elementor-element elementor-element-d0eb25c e-con-full e-flex e-con e-child\" data-id=\"d0eb25c\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t<div class=\"wd-negative-gap elementor-element elementor-element-baa143a e-flex e-con-boxed e-con e-child\" data-id=\"baa143a\" data-element_type=\"container\" data-e-type=\"container\" data-settings=\"{&quot;background_background&quot;:&quot;classic&quot;}\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t\t\t<div class=\"elementor-element elementor-element-3d3670a elementor-widget elementor-widget-wd_text_block\" data-id=\"3d3670a\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"wd_text_block.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"wd-text-block reset-last-child text-left\">\n\t\t\t\n\t\t\t<h3 class=\"header-vfC6AV auto-hide-last-sibling-br\" style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; font-size: 18px; font-weight: 700; line-height: 28px; color: rgb(0, 0, 0); overflow-anchor: auto; font-family: Inter, -apple-system, BlinkMacSystemFont, &quot;Segoe UI&quot;, &quot;PingFang SC&quot;, &quot;Hiragino Sans GB&quot;, &quot;Microsoft YaHei&quot;, &quot;Helvetica Neue&quot;, Helvetica, Arial, sans-serif; font-style: normal; font-variant-ligatures: normal; font-variant-caps: normal; text-transform: none; white-space-collapse: collapse; margin-bottom: 12px !important;\">I. Core Process Characteristics: Customized Processes for Ultra - thin Base Materials<\/h3><div class=\"auto-hide-last-sibling-br paragraph-JOTKXA paragraph-element br-paragraph-space\" style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; line-height: 24px; font-size: 16px; font-weight: 400; color: rgb(0, 0, 0); overflow-anchor: auto; font-family: Inter, -apple-system, BlinkMacSystemFont, &quot;Segoe UI&quot;, &quot;PingFang SC&quot;, &quot;Hiragino Sans GB&quot;, &quot;Microsoft YaHei&quot;, &quot;Helvetica Neue&quot;, Helvetica, Arial, sans-serif; font-style: normal; font-variant-ligatures: normal; font-variant-caps: normal; white-space-collapse: collapse;\">The 0.2mm rigid PCB is based on an ultra - thin FR - 4 base material (core - board thickness of 0.1 - 0.12mm, paired with a 0.03 - 0.05mm prepreg) and an additional 1\/3OZ (about 12\u03bcm) ultra - thin copper foil. The manufacturing process optimizes 5 key aspects based on the conventional PCB process:<\/div><div class=\"container-utlnW2 md-box-line-break wrapper-d0Cc1k undefined\" style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; margin-top: 20px; user-select: none; visibility: hidden; overflow-anchor: auto; color: rgb(0, 0, 0); font-family: Inter, -apple-system, BlinkMacSystemFont, &quot;Segoe UI&quot;, &quot;PingFang SC&quot;, &quot;Hiragino Sans GB&quot;, &quot;Microsoft YaHei&quot;, &quot;Helvetica Neue&quot;, Helvetica, Arial, sans-serif; font-size: 16px; font-style: normal; font-variant-ligatures: normal; font-variant-caps: normal; font-weight: 400; white-space-collapse: collapse;\"><\/div><ol class=\"auto-hide-last-sibling-br\" style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; padding-left: 20px; list-style-type: none; overflow-anchor: auto; color: rgb(0, 0, 0); font-family: Inter, -apple-system, BlinkMacSystemFont, &quot;Segoe UI&quot;, &quot;PingFang SC&quot;, &quot;Hiragino Sans GB&quot;, &quot;Microsoft YaHei&quot;, &quot;Helvetica Neue&quot;, Helvetica, Arial, sans-serif; font-size: 16px; font-style: normal; font-variant-ligatures: normal; font-variant-caps: normal; font-weight: 400; white-space-collapse: collapse; margin-top: 8px !important; margin-bottom: 8px !important;\"><li style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; margin-top: 8px; margin-bottom: 8px; padding-left: 4px; font-size: 16px; font-weight: 400; line-height: 24px; list-style-type: decimal; overflow-anchor: auto;\"><span style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; font-weight: 700; font-size: 16px; line-height: 28px; overflow-anchor: auto;\">Base - material Pretreatment: Ensuring Against Deformation at the Bottom<\/span><ul class=\"auto-hide-last-sibling-br\" style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; list-style-type: none; overflow-anchor: auto; margin-top: 4px !important; margin-bottom: 4px !important; padding-left: 20px !important;\"><li style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; margin-top: 4px; margin-bottom: 8px; padding-left: 4px; font-size: 16px; font-weight: 400; line-height: 24px; list-style-type: circle; overflow-anchor: auto;\"><span style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; font-weight: 700; font-size: 16px; line-height: 28px; overflow-anchor: auto;\">Material Selection and Adaptation<\/span>: Select a high - rigidity ultra - thin FR - 4 base material (Tg\u2265160\u2103, flexural strength\u2265450MPa) to avoid brittle fracture during processing. Choose \"low - profile electrolytic copper foil\" (roughness Ra\u22640.8\u03bcm) to reduce the stress difference between the base material and the copper foil.<\/li><li style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; margin-top: 4px; margin-bottom: 8px; padding-left: 4px; font-size: 16px; font-weight: 400; line-height: 24px; list-style-type: circle; overflow-anchor: auto;\"><span style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; font-weight: 700; font-size: 16px; line-height: 28px; overflow-anchor: auto;\">Cutting Protection<\/span>: Adopt the \"laser cutting + edge grinding\" process. Control the laser power at 5W (to avoid high - temperature ablation of the base material). After cutting, grind the edges with 1000# sandpaper (burrs\u22643\u03bcm) to prevent the base material from cracking in subsequent processes.<\/li><li style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; margin-top: 4px; margin-bottom: 8px; padding-left: 4px; font-size: 16px; font-weight: 400; line-height: 24px; list-style-type: circle; overflow-anchor: auto;\"><span style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; font-weight: 700; font-size: 16px; line-height: 28px; overflow-anchor: auto;\">Pre - baking and Shaping<\/span>: Bake with hot air at 120\u2103 for 1.5 hours, flipping the substrate every 30 minutes to ensure the water content of the base material is \u22640.03%, reducing warping after lamination (the warpage needs to be controlled within 0.5%).<\/li><\/ul><\/li><li style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; margin-top: 8px; margin-bottom: 8px; padding-left: 4px; font-size: 16px; font-weight: 400; line-height: 24px; list-style-type: decimal; overflow-anchor: auto;\"><span style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; font-weight: 700; font-size: 16px; line-height: 28px; overflow-anchor: auto;\">Inner - layer Circuit Manufacturing: Micron - level Precision Control<\/span><ul class=\"auto-hide-last-sibling-br\" style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; list-style-type: none; overflow-anchor: auto; margin-top: 4px !important; margin-bottom: 4px !important; padding-left: 20px !important;\"><li style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; margin-top: 4px; margin-bottom: 8px; padding-left: 4px; font-size: 16px; font-weight: 400; line-height: 24px; list-style-type: circle; overflow-anchor: auto;\"><span style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; font-weight: 700; font-size: 16px; line-height: 28px; overflow-anchor: auto;\">Thin - coating Process for Photosensitive Film<\/span>: The thickness of the photosensitive film for conventional PCBs is 15 - 20\u03bcm, but for the 0.2mm rigid board, it needs to be reduced to 8 - 10\u03bcm. Use the \"roll - coating + vacuum adsorption\" method to avoid blurring of the circuit edges due to an overly thick film layer. Use LDI laser imaging for exposure (resolution of 5\u03bcm) with a positioning accuracy of \u00b11\u03bcm to meet the demand for fine - line widths of 0.08 - 0.1mm.<\/li><li style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; margin-top: 4px; margin-bottom: 8px; padding-left: 4px; font-size: 16px; font-weight: 400; line-height: 24px; list-style-type: circle; overflow-anchor: auto;\"><span style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; font-weight: 700; font-size: 16px; line-height: 28px; overflow-anchor: auto;\">Low - temperature and Slow Etching<\/span>: Reduce the etchant temperature to 38\u00b11\u2103 (conventional 45\u2103) and control the etching rate at 0.8\u03bcm\/min (conventional 1.2\u03bcm\/min). Etch in three times (clean after each etching) to compress the under - etching amount from 12\u03bcm to 5\u03bcm, ensuring the line - width deviation is \u2264\u00b13\u03bcm.<\/li><li style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; margin-top: 4px; margin-bottom: 8px; padding-left: 4px; font-size: 16px; font-weight: 400; line-height: 24px; list-style-type: circle; overflow-anchor: auto;\"><span style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; font-weight: 700; font-size: 16px; line-height: 28px; overflow-anchor: auto;\">Double AOI Inspection<\/span>: In addition to the conventional circuit defect inspection, add \"base - material deformation detection\". Determine whether there are local protrusions on the substrate (protrusion height\u22642\u03bcm) through optical scanning to avoid misalignment in subsequent lamination.<\/li><\/ul><\/li><li style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; margin-top: 8px; margin-bottom: 8px; padding-left: 4px; font-size: 16px; font-weight: 400; line-height: 24px; list-style-type: decimal; overflow-anchor: auto;\"><span style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; font-weight: 700; font-size: 16px; line-height: 28px; overflow-anchor: auto;\">Lamination: Precise Pressing of the Ultra - thin Structure<\/span><ul class=\"auto-hide-last-sibling-br\" style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; list-style-type: none; overflow-anchor: auto; margin-top: 4px !important; margin-bottom: 4px !important; padding-left: 20px !important;\"><li style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; margin-top: 4px; margin-bottom: 8px; padding-left: 4px; font-size: 16px; font-weight: 400; line-height: 24px; list-style-type: circle; overflow-anchor: auto;\"><span style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; font-weight: 700; font-size: 16px; line-height: 28px; overflow-anchor: auto;\">Light - weight Lamination Design<\/span>: Adopt a two - layer structure of \"1 ultra - thin core board + 1 prepreg + 1 copper foil\" (0.2mm boards are mostly 2 - 4 layers). Select a \"low - resin - flow type\" prepreg (resin - flow amount\u226420%) to avoid exceeding the board - thickness standard due to excessive glue.<\/li><li style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; margin-top: 4px; margin-bottom: 8px; padding-left: 4px; font-size: 16px; font-weight: 400; line-height: 24px; list-style-type: circle; overflow-anchor: auto;\"><span style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; font-weight: 700; font-size: 16px; line-height: 28px; overflow-anchor: auto;\">Low - pressure Step - by - step Lamination<\/span>: Reduce the lamination pressure from the conventional 25kg\/cm\u00b2 to 15 - 18kg\/cm\u00b2. Optimize the temperature - control curve as follows: 60\u2103 (10min, for exhaust) \u2192 120\u2103 (20min, for initial curing) \u2192 160\u2103 (30min, for complete curing), with a heating rate of \u22645\u2103\/min at each stage to reduce thermal deformation of the base material.<\/li><li style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; margin-top: 4px; margin-bottom: 8px; padding-left: 4px; font-size: 16px; font-weight: 400; line-height: 24px; list-style-type: circle; overflow-anchor: auto;\"><span style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; font-weight: 700; font-size: 16px; line-height: 28px; overflow-anchor: auto;\">Real - time Board - thickness Monitoring<\/span>: During lamination, use a \"pressure sensor + thickness probe\" to monitor the board thickness in real - time (the deviation needs to be \u2264\u00b10.01mm). Adjust the pressure parameters immediately if the deviation exceeds the standard to avoid batch rejection.<\/li><\/ul><\/li><li style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; margin-top: 8px; margin-bottom: 8px; padding-left: 4px; font-size: 16px; font-weight: 400; line-height: 24px; list-style-type: decimal; overflow-anchor: auto;\"><span style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; font-weight: 700; font-size: 16px; line-height: 28px; overflow-anchor: auto;\">Drilling and Via Metallization: Preventing Breakthrough and Ensuring Conductivity<\/span><ul class=\"auto-hide-last-sibling-br\" style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; list-style-type: none; overflow-anchor: auto; margin-top: 4px !important; margin-bottom: 4px !important; padding-left: 20px !important;\"><li style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; margin-top: 4px; margin-bottom: 8px; padding-left: 4px; font-size: 16px; font-weight: 400; line-height: 24px; list-style-type: circle; overflow-anchor: auto;\"><span style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; font-weight: 700; font-size: 16px; line-height: 28px; overflow-anchor: auto;\">Micro - drill Selection and Parameter Control<\/span>: Use a \"tungsten - steel micro - drill\" (diameter of 0.1 - 0.2mm), increase the rotation speed to 120000r\/min, and reduce the feed rate to 5mm\/min. Replace the drill bit every 500 holes to prevent hole - position deviation caused by drill - bit wear (hole - position deviation\u2264\u00b10.02mm). After drilling, blow out the residue in the holes with 0.1MPa compressed air to avoid hole blockage.<\/li><li style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; margin-top: 4px; margin-bottom: 8px; padding-left: 4px; font-size: 16px; font-weight: 400; line-height: 24px; list-style-type: circle; overflow-anchor: auto;\"><span style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; font-weight: 700; font-size: 16px; line-height: 28px; overflow-anchor: auto;\">Low - temperature Copper - deposition Process<\/span>: Control the temperature of the copper - deposition solution at 28\u00b11\u2103 (conventional 35\u2103) and extend the copper - deposition time to 15 minutes to ensure the copper - layer thickness on the hole wall reaches 0.8 - 1\u03bcm (conventional 0.5\u03bcm). After copper - deposition, add a \"hole - conductivity test\". Use a micro - current detector (10mA current) to check for open - circuits in the holes, and the qualification rate needs to reach 100%.<\/li><li style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; margin-top: 4px; margin-bottom: 8px; padding-left: 4px; font-size: 16px; font-weight: 400; line-height: 24px; list-style-type: circle; overflow-anchor: auto;\"><span style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; font-weight: 700; font-size: 16px; line-height: 28px; overflow-anchor: auto;\">Thin - copper Electro - plating Reinforcement<\/span>: Reduce the electro - plating current density from 1.5A\/dm\u00b2 to 1A\/dm\u00b2 and control the electro - plating time at 20 minutes to thicken the copper layer on the hole wall to 5 - 8\u03bcm, avoiding substrate deformation caused by over - electro - plating.<\/li><\/ul><\/li><li style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; margin-top: 8px; margin-bottom: 8px; padding-left: 4px; font-size: 16px; font-weight: 400; line-height: 24px; list-style-type: decimal; overflow-anchor: auto;\"><span style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; font-weight: 700; font-size: 16px; line-height: 28px; overflow-anchor: auto;\">Post - treatment: Preventing Damage and Ensuring Reliability<\/span><ul class=\"auto-hide-last-sibling-br\" style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; list-style-type: none; overflow-anchor: auto; margin-top: 4px !important; margin-bottom: 4px !important; padding-left: 20px !important;\"><li style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; margin-top: 4px; margin-bottom: 8px; padding-left: 4px; font-size: 16px; font-weight: 400; line-height: 24px; list-style-type: circle; overflow-anchor: auto;\"><span style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; font-weight: 700; font-size: 16px; line-height: 28px; overflow-anchor: auto;\">Thin - coating and Curing of Solder - mask Layer<\/span>: Reduce the thickness of the solder - mask ink from 20 - 30\u03bcm to 10 - 15\u03bcm. Use the \"screen - printing + vacuum defoaming\" process to avoid exceeding the board - thickness standard due to ink accumulation. Reduce the curing temperature to 140\u2103 for 60 minutes (conventional 150\u2103) to reduce substrate warping caused by thermal stress.<\/li><li style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; margin-top: 4px; margin-bottom: 8px; padding-left: 4px; font-size: 16px; font-weight: 400; line-height: 24px; list-style-type: circle; overflow-anchor: auto;\"><span style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; font-weight: 700; font-size: 16px; line-height: 28px; overflow-anchor: auto;\">Surface - treatment Adaptation<\/span>: Give priority to \"tin - plating\" or \"OSP\" surface treatment (thickness\u22643\u03bcm) to avoid increasing the board thickness with the gold - plating process (gold - layer + nickel - layer thickness\u22657\u03bcm). After treatment, use a \"micro - force test pen\" to check the surface adhesion (adhesion\u22654B) to prevent coating peeling.<\/li><li style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; margin-top: 4px; margin-bottom: 8px; padding-left: 4px; font-size: 16px; font-weight: 400; line-height: 24px; list-style-type: circle; overflow-anchor: auto;\"><span style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; font-weight: 700; font-size: 16px; line-height: 28px; overflow-anchor: auto;\">Protection in Shape Processing<\/span>: Adopt the \"laser cutting + fixture fixation\" process. Set the laser power at 3W (to avoid high - temperature damage). Protect the edge of the substrate with 0.05MPa inert gas (nitrogen) during cutting to prevent delamination after cutting. After cutting, conduct a full inspection with a \"thickness gauge\" to ensure the board - thickness uniformity (the thickness difference on the same board\u22640.02mm).<\/li><\/ul><\/li><\/ol><h3 class=\"header-vfC6AV auto-hide-last-sibling-br\" style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; margin-top: 28px; font-size: 18px; font-weight: 700; line-height: 28px; color: rgb(0, 0, 0); overflow-anchor: auto; font-family: Inter, -apple-system, BlinkMacSystemFont, &quot;Segoe UI&quot;, &quot;PingFang SC&quot;, &quot;Hiragino Sans GB&quot;, &quot;Microsoft YaHei&quot;, &quot;Helvetica Neue&quot;, Helvetica, Arial, sans-serif; font-style: normal; font-variant-ligatures: normal; font-variant-caps: normal; text-transform: none; white-space-collapse: collapse; margin-bottom: 12px !important;\">II. Core Process Difficulties and Breakthrough Solutions<\/h3><ol class=\"auto-hide-last-sibling-br\" style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; padding-left: 20px; list-style-type: none; overflow-anchor: auto; color: rgb(0, 0, 0); font-family: Inter, -apple-system, BlinkMacSystemFont, &quot;Segoe UI&quot;, &quot;PingFang SC&quot;, &quot;Hiragino Sans GB&quot;, &quot;Microsoft YaHei&quot;, &quot;Helvetica Neue&quot;, Helvetica, Arial, sans-serif; font-size: 16px; font-style: normal; font-variant-ligatures: normal; font-variant-caps: normal; font-weight: 400; white-space-collapse: collapse; margin-top: 8px !important; margin-bottom: 8px !important;\"><li style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; margin-top: 8px; margin-bottom: 8px; padding-left: 4px; font-size: 16px; font-weight: 400; line-height: 24px; list-style-type: decimal; overflow-anchor: auto;\"><span style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; font-weight: 700; font-size: 16px; line-height: 28px; overflow-anchor: auto;\">Brittle Fracture of the Base Material during Processing<\/span><ul class=\"auto-hide-last-sibling-br\" style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; list-style-type: none; overflow-anchor: auto; margin-top: 4px !important; margin-bottom: 4px !important; padding-left: 20px !important;\"><li style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; margin-top: 4px; margin-bottom: 8px; padding-left: 4px; font-size: 16px; font-weight: 400; line-height: 24px; list-style-type: circle; overflow-anchor: auto;\"><span style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; font-weight: 700; font-size: 16px; line-height: 28px; overflow-anchor: auto;\">Pain Point<\/span>: The thickness of the 0.2mm base material is only 1\/8 of that of a conventional board. During mechanical processing (such as cutting and drilling), \"edge chipping\" is likely to occur (a chipping length of \u22650.5mm means rejection), and the rejection rate in the initial trial production can reach 15%.<\/li><li style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; margin-top: 4px; margin-bottom: 8px; padding-left: 4px; font-size: 16px; font-weight: 400; line-height: 24px; list-style-type: circle; overflow-anchor: auto;\"><span style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; font-weight: 700; font-size: 16px; line-height: 28px; overflow-anchor: auto;\">Solution<\/span>: \u2460 Use a \"vacuum - adsorption fixture\" (adsorption force of 0.3MPa) throughout the processing to avoid substrate deformation caused by mechanical clamping pressure. \u2461 Immediately coat the edges with \"epoxy resin edge - sealing liquid\" (thickness of 5\u03bcm) after cutting\/drilling to enhance crack resistance. \u2462 Store the base material in a \"hard tray with layered placement\" to avoid stacking and extrusion.<\/li><\/ul><\/li><li style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; margin-top: 8px; margin-bottom: 8px; padding-left: 4px; font-size: 16px; font-weight: 400; line-height: 24px; list-style-type: decimal; overflow-anchor: auto;\"><span style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; font-weight: 700; font-size: 16px; line-height: 28px; overflow-anchor: auto;\">Excessive Board - thickness Deviation after Lamination<\/span><ul class=\"auto-hide-last-sibling-br\" style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; list-style-type: none; overflow-anchor: auto; margin-top: 4px !important; margin-bottom: 4px !important; padding-left: 20px !important;\"><li style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; margin-top: 4px; margin-bottom: 8px; padding-left: 4px; font-size: 16px; font-weight: 400; line-height: 24px; list-style-type: circle; overflow-anchor: auto;\"><span style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; font-weight: 700; font-size: 16px; line-height: 28px; overflow-anchor: auto;\">Pain Point<\/span>: It is difficult to control the resin - flow amount of the ultra - thin prepreg. The board - thickness deviation after lamination easily exceeds \u00b10.03mm (the design requirement is \u00b10.02mm), affecting subsequent component mounting.<\/li><li style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; margin-top: 4px; margin-bottom: 8px; padding-left: 4px; font-size: 16px; font-weight: 400; line-height: 24px; list-style-type: circle; overflow-anchor: auto;\"><span style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; font-weight: 700; font-size: 16px; line-height: 28px; overflow-anchor: auto;\">Solution<\/span>: \u2460 \"Pre - press and shape\" the prepreg in advance (100\u2103\/5kg\/cm\u00b2, 10min) to reduce the resin - flow fluctuation during lamination. \u2461 Install \"thickness - limiting blocks\" (accuracy of \u00b10.005mm) inside the lamination mold to forcibly control the board thickness. \u2462 After laminating the first piece of each batch, scan the whole board with a \"laser thickness gauge\" (accuracy of 0.001mm). Start mass production only after it is qualified.<\/li><\/ul><\/li><li style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; margin-top: 8px; margin-bottom: 8px; padding-left: 4px; font-size: 16px; font-weight: 400; line-height: 24px; list-style-type: decimal; overflow-anchor: auto;\"><span style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; font-weight: 700; font-size: 16px; line-height: 28px; overflow-anchor: auto;\">Low Precision of Circuit Etching<\/span><ul class=\"auto-hide-last-sibling-br\" style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; list-style-type: none; overflow-anchor: auto; margin-top: 4px !important; margin-bottom: 4px !important; padding-left: 20px !important;\"><li style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; margin-top: 4px; margin-bottom: 8px; padding-left: 4px; font-size: 16px; font-weight: 400; line-height: 24px; list-style-type: circle; overflow-anchor: auto;\"><span style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; font-weight: 700; font-size: 16px; line-height: 28px; overflow-anchor: auto;\">Pain Point<\/span>: The ultra - thin copper foil (12\u03bcm) is prone to \"over - etching\" during etching, causing the 0.1mm line width to shrink to less than 0.08mm, exceeding the design tolerance.<\/li><li style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; margin-top: 4px; margin-bottom: 8px; padding-left: 4px; font-size: 16px; font-weight: 400; line-height: 24px; list-style-type: circle; overflow-anchor: auto;\"><span style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; font-weight: 700; font-size: 16px; line-height: 28px; overflow-anchor: auto;\">Solution<\/span>: \u2460 Use a \"negative - type photosensitive film\" (with 30% higher etching resistance than the conventional positive - type film) to reduce the erosion of the etchant on the circuit edges. \u2461 Add \"line - width compensation electro - plating\" after etching. Electro - plate with a current of 1A\/dm\u00b2 for 3 minutes to bring the line - width deviation back within \u00b13\u03bcm. \u2462 Establish an \"etching parameter database\" to automatically match the etching time according to the base - material thickness and copper - foil specifications (error\u226410 seconds).<\/li><\/ul><\/li><\/ol><h3 class=\"header-vfC6AV auto-hide-last-sibling-br\" style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; margin-top: 28px; font-size: 18px; font-weight: 700; line-height: 28px; color: rgb(0, 0, 0); overflow-anchor: auto; font-family: Inter, -apple-system, BlinkMacSystemFont, &quot;Segoe UI&quot;, &quot;PingFang SC&quot;, &quot;Hiragino Sans GB&quot;, &quot;Microsoft YaHei&quot;, &quot;Helvetica Neue&quot;, Helvetica, Arial, sans-serif; font-style: normal; font-variant-ligatures: normal; font-variant-caps: normal; text-transform: none; white-space-collapse: collapse; margin-bottom: 12px !important;\">III. Application Scenarios and Process - adaptation Cases<\/h3><ol class=\"auto-hide-last-sibling-br\" style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; padding-left: 20px; list-style-type: none; overflow-anchor: auto; color: rgb(0, 0, 0); font-family: Inter, -apple-system, BlinkMacSystemFont, &quot;Segoe UI&quot;, &quot;PingFang SC&quot;, &quot;Hiragino Sans GB&quot;, &quot;Microsoft YaHei&quot;, &quot;Helvetica Neue&quot;, Helvetica, Arial, sans-serif; font-size: 16px; font-style: normal; font-variant-ligatures: normal; font-variant-caps: normal; font-weight: 400; white-space-collapse: collapse; margin-top: 8px !important; margin-bottom: 8px !important;\"><li style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; margin-top: 8px; margin-bottom: 8px; padding-left: 4px; font-size: 16px; font-weight: 400; line-height: 24px; list-style-type: decimal; overflow-anchor: auto;\"><span style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; font-weight: 700; font-size: 16px; line-height: 28px; overflow-anchor: auto;\">Smart Wearable Devices<\/span>: For example, the motherboard of a Huawei watch (0.2mm 4 - layer PCB) adopts the \"laser cutting + LDI exposure\" process to achieve a 0.08mm fine - line width. At the same time, \"tin - plating surface treatment\" is used to reduce the board thickness, meeting the mini - assembly requirements of the watch.<\/li><li style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; margin-top: 8px; margin-bottom: 8px; padding-left: 4px; font-size: 16px; font-weight: 400; line-height: 24px; list-style-type: decimal; overflow-anchor: auto;\"><span style=\"-webkit-font-smoothing: antialiased; -webkit-tap-highlight-color: rgba(0, 0, 0, 0); outline: none; border-style: solid; font-weight: 700; font-size: 16px; line-height: 28px; overflow-anchor: auto;\">Minimally - invasive Medical Sensors<\/span>: The 0.2mm PCB for a blood - glucose monitoring sensor needs to be processed in a sterile environment. Add \"plasma cleaning\" (to remove surface impurities) and \"vacuum packaging\" in the process to ensure biocompatibility. At the same time, use \"low - temperature lamination\" to avoid the release of harmful substances from the base material.<\/li><\/ol><p><\/p>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-eb3770d elementor-widget elementor-widget-wd_image_or_svg\" data-id=\"eb3770d\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"wd_image_or_svg.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\n\t\t<div class=\"wd-image text-left\">\n\t\t\t\t\t\t\t\t<img decoding=\"async\" width=\"726\" height=\"582\" src=\"https:\/\/ulpcb.com\/wp-content\/uploads\/2025\/09\/0.2MM-PCB.png\" class=\"attachment-full size-full\" alt=\"The 0.2mm - thick rigid PCB (while the thickness of conventional PCBs is mostly 0.8 - 1.6mm), due to its &quot;ultra - thin and lightweight&quot; characteristics, has become the core carrier for smart wearables, micro - sensors, and minimally - invasive medical devices\" srcset=\"https:\/\/ulpcb.com\/wp-content\/uploads\/2025\/09\/0.2MM-PCB.png 726w, https:\/\/ulpcb.com\/wp-content\/uploads\/2025\/09\/0.2MM-PCB-300x240.png 300w, https:\/\/ulpcb.com\/wp-content\/uploads\/2025\/09\/0.2MM-PCB-15x12.png 15w\" sizes=\"(max-width: 726px) 100vw, 726px\" \/>\t\t\t\t\t<\/div>\n\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>","protected":false},"excerpt":{"rendered":"<p>Home\u9875\u9762 Special PCB The 0.2mm &#8211; thick rigid PCB (while the thickness of conventional PCBs is mostly 0.8 &#8211; 1.6mm),<\/p>","protected":false},"author":1,"featured_media":0,"parent":15,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"footnotes":""},"class_list":["post-37","page","type-page","status-publish","hentry"],"_links":{"self":[{"href":"https:\/\/ulpcb.com\/de\/wp-json\/wp\/v2\/pages\/37","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/ulpcb.com\/de\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/ulpcb.com\/de\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/ulpcb.com\/de\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/ulpcb.com\/de\/wp-json\/wp\/v2\/comments?post=37"}],"version-history":[{"count":7,"href":"https:\/\/ulpcb.com\/de\/wp-json\/wp\/v2\/pages\/37\/revisions"}],"predecessor-version":[{"id":1244,"href":"https:\/\/ulpcb.com\/de\/wp-json\/wp\/v2\/pages\/37\/revisions\/1244"}],"up":[{"embeddable":true,"href":"https:\/\/ulpcb.com\/de\/wp-json\/wp\/v2\/pages\/15"}],"wp:attachment":[{"href":"https:\/\/ulpcb.com\/de\/wp-json\/wp\/v2\/media?parent=37"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}