{"id":1217,"date":"2025-09-27T19:59:45","date_gmt":"2025-09-27T11:59:45","guid":{"rendered":"https:\/\/ulpcb.com\/?p=1217"},"modified":"2025-09-27T20:39:05","modified_gmt":"2025-09-27T12:39:05","slug":"principle-and-application-of-laser-drilling-in-hdi-manufacturing","status":"publish","type":"post","link":"https:\/\/ulpcb.com\/ary\/principle-and-application-of-laser-drilling-in-hdi-manufacturing\/","title":{"rendered":"Principle and Application of Laser Drilling in HDI Manufacturing"},"content":{"rendered":"
\u5728HDI\uff08\u9ad8\u5bc6\u5ea6\u4e92\u8fde\uff09\u677f\u7684\u5236\u9020\u8fc7\u7a0b\u4e2d\uff0c\u6fc0\u5149\u94bb\u5b54\u662f\u5b9e\u73b0\u201c\u5fae\u5b54\u5f84\uff0c\u9ad8\u5bc6\u5ea6\u4e92\u8fde\u201d\u7684\u6838\u5fc3\u5de5\u827a\u3002\u5b83\u5229\u7528\u9ad8\u80fd\u6fc0\u5149\u675f\u7684\u70ed\u6216\u5149\u5316\u5b66\u6548\u5e94\u6765\u521b\u5efa\u76f2\u5b54\u548c\u57cb\u5b54\uff08\u6709\u65f6\u5c0f\u81f310\u03bcm\u4ee5\u4e0b\uff09\uff0c\u5176\u76f4\u5f84\u901a\u5e38\u5728\u00a0<\/span><\/span>25\u03bcm\u5230150\u03bcm\u4e4b\u95f4<\/span><\/span><\/strong>\u00a0\u5728\u5370\u5237\u7535\u8def\u677f\uff08PCB\uff09\u57fa\u677f\u4e0a\u3002\u8fd9\u53d6\u4ee3\u4e86\u4f20\u7edf\u673a\u68b0\u94bb\u5b54\u65e0\u6cd5\u5b9e\u73b0\u7684\u5fae\u5c0f\u5b54\u5f84\u52a0\u5de5\uff0c\u4e3a\u9ad8\u5bc6\u5ea6\u4e92\u8fde\uff08HDI\uff09\u677f\u7684\u201c\u591a\u5c42\u548c\u5fae\u578b\u5316\u201d\u53d1\u5c55\u63d0\u4f9b\u4e86\u5173\u952e\u652f\u6301\u3002\u4e0e\u673a\u68b0\u94bb\u5b54\u76f8\u6bd4\uff0c\u6fc0\u5149\u94bb\u5b54\u5177\u6709\u201c\u65e0\u5de5\u5177\u78e8\u635f\u3001\u9ad8\u5b54\u5f84\u7cbe\u5ea6\u4ee5\u53ca\u4e0e\u67d4\u6027\/\u9ad8\u9891\u57fa\u677f\u7684\u517c\u5bb9\u6027\u201d\u7b49\u4f18\u70b9\uff0c\u4f7f\u5176\u6210\u4e3aHDI\u677f\uff08\u5c24\u5176\u662f2\u5c42\u53ca\u4ee5\u4e0a\u7684HDI\uff09\u5236\u9020\u4e2d\u4e0d\u53ef\u6216\u7f3a\u7684\u5de5\u827a\u3002<\/span><\/span><\/div>\n

1. \u6fc0\u5149\u94bb\u5b54\u7684\u6838\u5fc3\u539f\u7406\uff1a\u80fd\u91cf\u805a\u7126\u548c\u57fa\u677f\u76f8\u4e92\u4f5c\u7528\u673a\u5236<\/span><\/span><\/h2>\n
\u6fc0\u5149\u94bb\u5b54\u7684\u672c\u8d28\u662f\u201c\u5c06\u9ad8\u80fd\u6fc0\u5149\u675f\u805a\u7126\u5728\u5c40\u90e8\u533a\u57df\u201d\u300214\u5c42\u677f\u662f\u6307\u5305\u542b14\u4e2a\u5bfc\u7535\u7535\u8def\u5c42\uff08\u94dc\u7b94\u5c42\uff09\u7684\u5370\u5237\u7535\u8def\u677f\u3002\u5b83\u901a\u8fc7\u4ea4\u66ff\u5806\u53e013\u5c42\u7edd\u7f18\u57fa\u6750\uff08\u5982FR-4\u57fa\u677f\uff09\u548c14\u4e2a\u5bfc\u7535\u5c42\uff0c\u7136\u540e\u5728\u9ad8\u6e29\u9ad8\u538b\u4e0b\u538b\u5408\u5728\u4e00\u8d77\uff0c\u5f62\u6210\u4e00\u4e2a\u6574\u4f53\u3002\u5c42\u95f4\u7684\u7535\u6c14\u8fde\u63a5\u662f\u901a\u8fc7\u91d1\u5c5e\u5316\u5b54\uff08\u901a\u5b54\u3001\u76f2\u5b54\u3001\u57cb\u5b54\uff09\u5b9e\u73b0\u7684\u3002\u5176\u6838\u5fc3\u7ed3\u6784\u7279\u5f81\u53cd\u6620\u5728\u201c\u9010\u5c42\u89c4\u5212\u548c\u529f\u80fd\u5206\u533a\u201d \u7684\u57fa\u677f\u4e0a\uff0c\u5e76\u901a\u8fc7\u80fd\u91cf\u8f6c\u6362\u7834\u574f\u57fa\u677f\u7684\u5206\u5b50\u7ed3\u6784\u4ee5\u5b9e\u73b0\u6750\u6599\u53bb\u9664\u3002\u6839\u636eHDI\u57fa\u677f\u7684\u7c7b\u578b\uff08\u5982FR-4\uff0cPI\u67d4\u6027\u57fa\u677f\uff0c\u9ad8\u9891PTFE\u57fa\u677f\uff0c\u5b83\u4e3b\u8981\u5206\u4e3a\u4e24\u7c7b\uff1a\u00a0<\/span><\/span>\u70ed\u6d88\u878d\u673a\u5236<\/span><\/span><\/strong>\u00a0\u548c\u00a0<\/span><\/span>\u5149\u5316\u5b66\u6d88\u878d\u673a\u5236<\/span><\/span><\/strong>\u3002\u5176\u5177\u4f53\u539f\u7406\u5dee\u5f02\u5982\u4e0b\uff1a<\/span><\/span><\/div>\n

<\/p>\n

(1) \u70ed\u6d88\u878d\u673a\u5236\uff1a\u9002\u7528\u4e8e\u6811\u8102\u57fa\u5e95\uff08\u4e3b\u6d41\u5e94\u7528\uff09<\/span><\/span><\/h3>\n
\u57fa\u4e8e\u6811\u8102\u7684\u6750\u6599\uff0c\u5982\u7528\u4e8eHDI\u677f\u7684FR-4\u548cPI\u67d4\u6027\u57fa\u677f\uff0c\u901a\u5e38\u901a\u8fc7\u70ed\u6c14\u5316\u673a\u5236\u8fdb\u884c\u94bb\u5b54\u3002\u6838\u5fc3\u5de5\u827a\u5206\u4e3a\u56db\u4e2a\u9636\u6bb5\uff0c\u672c\u8d28\u4e0a\u662f\u201c\u5c06\u6fc0\u5149\u80fd\u91cf\u8f6c\u5316\u4e3a\u70ed\u80fd\uff0c\u5feb\u901f\u52a0\u70ed\u57fa\u677f\u81f3\u5206\u89e3\u6e29\u5ea6\uff0c\u5e76\u901a\u8fc7\u6c14\u5316\u548c\u7194\u5316\u55b7\u6e85\u5b9e\u73b0\u6750\u6599\u53bb\u9664\u201d\u3002<\/span><\/span><\/div>\n
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  1. \n
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    \u80fd\u91cf\u805a\u7126\u53f0<\/span><\/span><\/strong>:<\/span><\/span><\/p>\n

    <\/div>\n

    \u7531\u6fc0\u5149\u53d1\u751f\u5668\uff08\u5982CO\u2082\u6fc0\u5149\u3001\u7d2b\u5916\u7ebf\u6fc0\u5149\uff09\u4ea7\u751f\u7684\u8fde\u7eed\u6216\u8109\u51b2\u6fc0\u5149\u675f\u901a\u8fc7\u5149\u5b66\u7cfb\u7edf\uff08\u805a\u7126\u900f\u955c\u3001\u53cd\u5c04\u955c\uff09\u805a\u7126\uff0c\u5f62\u6210\u4e00\u4e2a\u76f4\u5f84\u53ea\u6709\u51e0\u5fae\u7c73\u5230\u51e0\u5341\u5fae\u7c73\u7684\u201c\u9ad8\u80fd\u5149\u6591\u201d\uff0c\u80fd\u91cf\u5bc6\u5ea6\u9ad8\u8fbe\u00a0<\/span><\/span>10\u2076-10\u2079 W\/cm\u00b2<\/span><\/span><\/strong>\uff0c\u7cbe\u786e\u4f5c\u7528\u4e8e\u57fa\u677f\u4e0a\u9700\u8981\u94bb\u5b54\u7684\u533a\u57df\u3002<\/span><\/span><\/p>\n<\/div>\n<\/li>\n

  2. \n
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    \u57fa\u5e95\u52a0\u70ed\u548c\u5206\u89e3\u53f0<\/span><\/span><\/strong>:<\/span><\/span><\/p>\n

    <\/div>\n

    \u805a\u7126\u7684\u6fc0\u5149\u80fd\u91cf\u8fc5\u901f\u4f20\u9012\u5230\u57fa\u677f\uff08\u6811\u8102+\u73bb\u7483\u7ea4\u7ef4\/PI\u819c\uff09\u4e0a\uff0c\u4f7f\u5c40\u90e8\u6e29\u5ea6\u6025\u5267\u4e0a\u5347\u81f3\u6811\u8102\u7684\u5206\u89e3\u6e29\u5ea6\uff08\u901a\u5e38\u4e3a400-600\u2103\uff0cFR-4\u6811\u8102\u7ea6\u4e3a450\u2103\uff0cPI\u6811\u8102\u4e3a550\u2103\uff09\u00a0<\/span><\/span>\u5fae\u79d2\uff08\u03bcs\uff09\u6216\u751a\u81f3\u7eb3\u79d2\uff08ns\uff09<\/span><\/span><\/strong>\u5185\u3002\u6b64\u65f6\uff0c\u6811\u8102\u5206\u5b50\u94fe\u5206\u89e3\u6210CO\u2082\u3001H\u2082O\u548c\u5c0f\u5206\u5b50\u6709\u673a\u7269\u7b49\u6c14\u6001\u4ea7\u7269\uff0c\u800c\u73bb\u7483\u7ea4\u7ef4\uff08\u5728FR-4\u4e2d\uff09\u6216PI\u819c\u5728\u9ad8\u6e29\u4e0b\u90e8\u5206\u7194\u5316\u5e76\u6c14\u5316\u3002<\/span><\/span><\/p>\n<\/div>\n<\/li>\n

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    \u6750\u6599\u53bb\u9664\u9636\u6bb5<\/span><\/span><\/strong>:<\/span><\/span><\/p>\n

    <\/div>\n

    \u57fa\u677f\u5206\u89e3\u4ea7\u751f\u7684\u6c14\u6001\u4ea7\u7269\u548c\u7194\u878d\u7269\u8d28\u5728\u9ad8\u6e29\u548c\u538b\u529b\u7684\u4f5c\u7528\u4e0b\u4ee5\u201c\u98de\u6e85\u201d\u7684\u5f62\u5f0f\u4ece\u57fa\u677f\u8868\u9762\u5206\u79bb\uff0c\u5f62\u6210\u521d\u6b65\u7684\u201c\u5b54\u5751\u201d\u3002\u540c\u65f6\uff0c\u6fc0\u5149\u675f\u53ef\u4ee5\u901a\u8fc7\u201c\u591a\u8109\u51b2\u626b\u63cf\u201d\uff08\u5373\u5bf9\u540c\u4e00\u533a\u57df\u91cd\u590d\u4f5c\u7528\u591a\u4e2a\u8109\u51b2\u6fc0\u5149\uff09\u9010\u6b65\u52a0\u6df1\u5b54\u5751\uff0c\u76f4\u5230\u6ee1\u8db3\u8bbe\u8ba1\u8981\u6c42\uff08\u4f8b\u5982\uff0c\u76f2 Via \u9700\u8981\u51c6\u786e\u63a7\u5236\u6df1\u5ea6\u4ee5\u907f\u514d\u7a7f\u900f\u4e0b\u5c42\u7535\u8def\uff09\u3002<\/span><\/span><\/p>\n<\/div>\n<\/li>\n

  4. \n
    \n

    \u94bb\u5b54\u58c1\u51b7\u5374\u548c\u6210\u578b\u9636\u6bb5<\/span><\/span><\/strong>:<\/span><\/span><\/p>\n

    <\/div>\n

    After the laser pulse ends, the temperature of the hole wall area drops rapidly (the cooling rate can reach 10\u2075\u2103\/s). The remaining molten substances (such as glass fiber debris and resin carbonized layer) will form a “carbonized layer” (usually 0.5-2\u03bcm thick) on the hole wall, which needs to be removed in the subsequent “desmear” process to ensure the reliability of hole wall metallization.<\/p>\n<\/div>\n<\/li>\n<\/ol>\n

    <\/div>\n
    Application Scenarios<\/strong>: FR-4 substrates (ordinary HDI boards), PI flexible substrates (flexible HDI boards), ceramic-filled resin substrates (high-power HDI boards), accounting for more than 90% of laser drilling applications in HDI; the commonly used laser types are\u00a0CO\u2082 lasers<\/strong>\u00a0(wavelength 10.6\u03bcm, suitable for resin removal) and\u00a0ultraviolet lasers<\/strong>\u00a0(wavelength 355nm\/266nm, suitable for high-precision, low-heat-impact processing).<\/div>\n

    (2) Photochemical Ablation Mechanism: Suitable for High-Frequency\/Special Substrates<\/h3>\n
    For PTFE (polytetrafluoroethylene) substrates used in high-frequency scenarios in HDI boards or ultra-thin substrates sensitive to heat (such as PI films with a thickness of \u226425\u03bcm), the thermal ablation mechanism is likely to cause substrate deformation and hole wall carbonization (affecting high-frequency signal transmission). Therefore, the\u00a0photochemical ablation mechanism<\/strong>\u00a0is required, whose core is “laser energy directly breaking the chemical bonds of substrate molecules without high-temperature heating, achieving heat-free damage drilling”:<\/div>\n
    <\/div>\n
      \n
    1. \n
      \n

      Photon Absorption and Chemical Bond Breaking<\/strong>:<\/p>\n

      <\/div>\n

      A\u00a0deep ultraviolet (DUV) laser with an extremely short wavelength (wavelength 193nm)<\/strong>\u00a0or an\u00a0excimer laser<\/strong>\u00a0is used, whose photon energy (about 6.4eV) is higher than the bond energy of C-C bonds (3.6eV) and C-F bonds (4.8eV) in PTFE molecules. When the laser irradiates the substrate, photons are directly absorbed by the substrate molecules, and the molecular chemical bonds can be broken without converting into thermal energy, decomposing PTFE into small-molecule fluorides (such as CF\u2084) and gaseous carbon.<\/p>\n<\/div>\n<\/li>\n

    2. \n
      \n

      Heat-Free Damage Material Removal<\/strong>:<\/p>\n

      <\/div>\n

      There is no obvious temperature rise during the entire process (the local temperature of the substrate is usually below 100\u2103), so there is no melting, carbonization, or thermal deformation. The hole wall has extremely high smoothness (roughness Ra \u22640.1\u03bcm) and no heat-affected zone (HAZ), which perfectly meets the requirements of high-frequency signals for “low loss and low interference”.<\/p>\n<\/div>\n<\/li>\n

    3. \n
      \n

      Precise Depth Control and Forming<\/strong>:<\/p>\n

      <\/div>\n

      By controlling the number of laser pulses (the thickness of material removed by a single pulse is only a few nanometers to tens of nanometers), “atomic-level” precise depth control of the PTFE substrate can be achieved, which is especially suitable for the processing requirement of “blind vias penetrating the insulating layer without damaging the underlying ground copper foil” in high-frequency HDI boards.<\/p>\n<\/div>\n<\/li>\n<\/ol>\n

      <\/div>\n
      Application Scenarios<\/strong>: PTFE substrates for high-frequency HDI boards (such as 5G millimeter-wave radar HDI, satellite communication HDI) and PI substrates for ultra-thin flexible HDI boards; due to the high cost of equipment (the price of DUV laser equipment is about 5-10 times that of CO\u2082 lasers), it is currently mainly used in high-end HDI scenarios.<\/div>\n

      2. Key Technical Parameters of Laser Drilling for HDI: Determining Drilling Quality and Reliability<\/h2>\n
      HDI boards have strict requirements for “aperture accuracy, hole wall quality, and depth control accuracy” of laser drilling. The following core parameters need to be accurately controlled to ensure that the drilling meets the requirements of subsequent hole metallization and signal transmission:<\/div>\n
      <\/div>\n
      \n
      \n\n\n\n\n\n\n\n\n\n
      Technical Parameter<\/th>\nDefinition and Function<\/th>\nTypical Requirements for HDI Boards<\/th>\nImpact on HDI Performance<\/th>\n<\/tr>\n<\/thead>\n
      Aperture Accuracy<\/strong><\/td>\nDeviation between the actual aperture and the designed aperture, including diameter deviation and roundness<\/td>\nDiameter deviation \u2264\u00b15\u03bcm, roundness \u22650.9 (i.e., the ratio of major axis to minor axis of the hole \u22641.1)<\/td>\nToo small an aperture will lead to poor conduction after hole metallization; too large an aperture is likely to cause short circuits between circuits, affecting high-density wiring<\/td>\n<\/tr>\n
      Hole Position Accuracy<\/strong><\/td>\nPosition deviation between the actual hole center and the designed hole center<\/td>\nPosition deviation \u2264\u00b13\u03bcm (2nd-order HDI), \u2264\u00b11.5\u03bcm (3rd-order HDI)<\/td>\nHole position deviation will cause “misalignment” between blind vias and inner circuits, resulting in “broken holes” or “edge contact”, reducing interconnection reliability<\/td>\n<\/tr>\n
      Depth Control Accuracy<\/strong><\/td>\nDeviation between the actual depth and the designed depth of blind vias<\/td>\nDepth deviation \u2264\u00b15% (e.g., designed depth 50\u03bcm, actual depth 47.5-52.5\u03bcm)<\/td>\nToo shallow a depth will prevent the hole from penetrating the insulating layer after metallization, failing to achieve inter-layer interconnection; too deep a depth will penetrate the underlying copper foil, causing short circuits<\/td>\n<\/tr>\n
      Hole Wall Roughness<\/strong><\/td>\nDegree of unevenness on the hole wall surface (expressed by Ra)<\/td>\nRa \u22641.5\u03bcm for ordinary HDI, Ra \u22640.5\u03bcm for high-frequency HDI<\/td>\nExcessively high hole wall roughness will lead to uneven copper layer coverage during chemical copper plating, increasing the transmission loss of high-frequency signals; it may also leave drill debris, causing poor insulation<\/td>\n<\/tr>\n
      Heat-Affected Zone (HAZ)<\/strong><\/td>\nWidth of the area where the substrate’s performance changes due to thermal effects after drilling<\/td>\nHAZ \u226410\u03bcm for ordinary HDI, HAZ \u22645\u03bcm for high-frequency\/flexible HDI<\/td>\nExcessively large HAZ will cause brittleness of the substrate (such as PI), reducing the bending life of flexible HDI; HAZ in high-frequency substrates will cause fluctuations in Dk\/Df, affecting signal integrity<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n

      3. Typical Application Scenarios of Laser Drilling in HDI: From Ordinary HDI to High-End Special HDI<\/h2>\n
      The application of laser drilling in HDI boards mainly solves the pain point that “traditional mechanical drilling cannot process micro-apertures and is incompatible with special substrates”. According to the type and application field of HDI boards, it is mainly divided into the following three scenarios:<\/div>\n

      (1) Ordinary HDI Boards: Mainstream Application in Consumer Electronics<\/h3>\n
      In HDI boards for consumer electronics such as mobile phone motherboards, tablets, and smart watches, laser drilling is mainly used to process\u00a01st-order\/2nd-order blind vias<\/strong>\u00a0to achieve “high-density interconnection between surface circuits and inner circuits”. The typical application characteristics are:<\/div>\n
      <\/div>\n
        \n
      • Substrate Type<\/strong>: Mainly FR-4 substrates (PI substrates are used in some flexible areas);<\/li>\n
      • Aperture Specification<\/strong>: Blind via diameter 50-100\u03bcm, depth 20-50\u03bcm (corresponding to the thickness of the HDI board insulating layer);<\/li>\n
      • Laser Type<\/strong>: Mainly CO\u2082 lasers (moderate cost, high processing efficiency), and ultraviolet lasers are used in some high-precision areas;<\/li>\n
      • Core Requirement<\/strong>: Meeting the high-density layout of “hundreds of holes per square centimeter” to adapt to the “miniaturized chips and dense components” in mobile phone motherboards (for example, the laser blind via density in iPhone motherboards can reach more than 500 holes\/cm\u00b2).<\/li>\n<\/ul>\n
        <\/div>\n
        Case<\/strong>: In the “BGA (Ball Grid Array) area” of a mobile phone motherboard, the chip pin pitch is only 0.3mm. Laser drilling is required to process blind vias with a diameter of 60\u03bcm to connect the surface BGA pads to the inner power\/signal layers, realizing reliable interconnection of “narrow-pitch pins”. Traditional mechanical drilling (minimum aperture about 150\u03bcm) cannot meet this requirement.<\/div>\n

        (2) Flexible HDI Boards: Adaptation to Dynamic Bending Scenarios<\/h3>\n
        In flexible HDI boards such as folding screen mobile phone hinge circuits and smart watch strap circuits, laser drilling needs to balance “micro-aperture” and “low damage” to avoid substrate brittleness caused by drilling. The typical application characteristics are:<\/div>\n
        <\/div>\n
          \n
        • Substrate Type<\/strong>: PI flexible substrates (thickness 25-50\u03bcm), some matched with ultra-thin copper foil (12-18\u03bcm);<\/li>\n
        • Aperture Specification<\/strong>: Blind via diameter 30-60\u03bcm, depth 15-30\u03bcm, with strict control of the heat-affected zone (HAZ \u22645\u03bcm);<\/li>\n
        • Laser Type<\/strong>: Ultraviolet lasers (wavelength 355nm) are preferred, which have lower thermal effects than CO\u2082 lasers and can reduce thermal damage to PI substrates;<\/li>\n
        • Core Requirement<\/strong>: The bending life of the flexible HDI board after drilling is \u2265100,000 times (180\u00b0 bending), with no cracks or carbonization on the hole wall, ensuring that the hole metallized copper layer does not fall off during dynamic bending.<\/li>\n<\/ul>\n
          <\/div>\n
          Case<\/strong>: For the “hinge flexible circuit” of a folding screen mobile phone, it is necessary to process blind vias with a diameter of 40\u03bcm on a PI substrate with a width of only 2mm to connect the surface and inner circuits. The low thermal damage characteristic of laser drilling can prevent the PI substrate from cracking from the hole wall during bending, ensuring the folding life.<\/div>\n

          (3) High-Frequency HDI Boards: Low-Loss Requirement for High-End Communication<\/h3>\n
          In 5G millimeter-wave radar HDI and satellite communication HDI boards, laser drilling needs to meet “low loss and high signal integrity” to avoid hole wall defects affecting high-frequency signal transmission. The typical application characteristics are:<\/div>\n
          <\/div>\n
            \n
          • Substrate Type<\/strong>: PTFE high-frequency substrates (Df \u22640.001) or hydrocarbon composite substrates (such as Rogers RO4003C);<\/li>\n
          • Aperture Specification<\/strong>: Blind via diameter 25-50\u03bcm, depth 10-30\u03bcm, hole wall roughness Ra \u22640.5\u03bcm, no carbonized layer;<\/li>\n
          • Laser Type<\/strong>: Deep ultraviolet (DUV) lasers (193nm) are used in high-end scenarios to achieve heat-free damage drilling through photochemical ablation; ultraviolet lasers (355nm) are used in mid-to-high-end scenarios;<\/li>\n
          • Core Requirement<\/strong>: No impurities or heat-affected zones on the hole wall, ensuring that the insertion loss of high-frequency signals (24GHz\/77GHz) during transmission in the hole is \u22640.1dB (10GHz) and the return loss is \u2265-25dB, avoiding signal reflection or attenuation.<\/li>\n<\/ul>\n
            <\/div>\n
            Case<\/strong>: For a 77GHz millimeter-wave radar HDI board of an automobile, it is necessary to process blind vias with a diameter of 30\u03bcm through laser to connect the RF chip and the antenna layer. The high smoothness of the hole wall can reduce the “scattering loss” of high-frequency signals, ensuring that the radar detection distance is \u2265200m and the accuracy is \u00b10.1m. The carbonized layer formed by traditional thermal ablation drilling will increase the signal loss by more than 30%, which cannot meet the requirement.<\/div>\n

            4. Comparison Between Laser Drilling and Traditional Mechanical Drilling: Advantages Highlighted in HDI Scenarios<\/h2>\n
            In the manufacturing of HDI boards, there are significant differences between laser drilling and traditional mechanical drilling (using cemented carbide drills). The advantages of laser drilling are particularly prominent in “micro-aperture, special substrate, and high-density” scenarios:<\/div>\n
            <\/div>\n
            \n
            \n\n\n\n\n\n\n\n\n\n
            Comparison Dimension<\/th>\nLaser Drilling<\/th>\nTraditional Mechanical Drilling<\/th>\nConclusion (HDI Scenario)<\/th>\n<\/tr>\n<\/thead>\n
            Minimum Aperture<\/strong><\/td>\nDown to 10\u03bcm (DUV laser), conventional 25-100\u03bcm<\/td>\nMinimum about 150\u03bcm, hard to break through 100\u03bcm<\/td>\nLaser drilling fully meets the micro-aperture requirement of HDI<\/td>\n<\/tr>\n
            Hole Position Accuracy<\/strong><\/td>\n\u00b11.5-3\u03bcm (optical positioning)<\/td>\n\u00b110-15\u03bcm (mechanical positioning, easily affected by tool wear)<\/td>\nLaser drilling meets the high-precision requirement of multi-layer alignment in HDI<\/td>\n<\/tr>\n
            Substrate Compatibility<\/strong><\/td>\nCompatible with FR-4, PI, PTFE, etc., no tool wear<\/td>\nOnly compatible with rigid substrates such as FR-4, tools are easily worn (PTFE wears drills)<\/td>\nLaser drilling covers all substrate types of HDI<\/td>\n<\/tr>\n
            Processing Efficiency<\/strong><\/td>\nSingle-hole processing time \u22641\u03bcs (pulsed laser), suitable for mass production<\/td>\nSingle-hole processing time \u226510\u03bcs, efficiency drops sharply for small apertures<\/td>\nLaser drilling is more efficient in high-frequency HDI and high-density HDI scenarios<\/td>\n<\/tr>\n
            Thermal Damage\/Tool Wear<\/strong><\/td>\nSlight HAZ in thermal ablation (controllable), no tool wear<\/td>\nNo thermal damage, but tools are easily worn (tools need to be replaced after processing 10,000 holes)<\/td>\nLaser drilling reduces consumable costs and is suitable for long-term mass production<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n

            5. Conclusion<\/h2>\n
            Through precise control of the “energy focusing and substrate interaction mechanism”, laser drilling solves the core problems of “micro-aperture, high-density interconnection, and special substrate adaptation” in HDI boards, and is a key process for the upgrading of HDI boards from “1st-order to 3rd-order and above” and from “ordinary consumer electronics to high-end high-frequency communication”. The evolution of its principle from “thermal ablation” to “photochemical ablation” adapts to the characteristics of different HDI substrates; and the strict control of “aperture accuracy, depth control accuracy, and hole wall quality” directly determines the interconnection reliability and signal performance of HDI boards.<\/div>\n
            <\/div>\n
            \u968f\u7740HDI\u677f\u5411\u201c\u66f4\u9ad8\u5bc6\u5ea6\uff08\u5b54\u5f84\u226420\u03bcm\uff09\u3001\u66f4\u9ad8\u9891\u7387\uff08\u2265100GHz\uff09\u3001\u66f4\u8584\u57fa\u677f\uff08\u226425\u03bcm\uff09\u201d\u65b9\u5411\u53d1\u5c55\uff0c\u6fc0\u5149\u94bb\u5b54\u6280\u672f\u4e5f\u5c06\u8fed\u4ee3\u5411\u201c\u66f4\u77ed\u6ce2\u957f\u7684\u6fc0\u5149\uff08\u5982\u6781\u7d2b\u5916EUV\uff09\u3001\u66f4\u9ad8\u7684\u5b9a\u4f4d\u7cbe\u5ea6\uff08\u22641\u03bcm\uff09\u3001\u66f4\u4f4e\u7684\u70ed\u635f\u4f24\u201d\u53d1\u5c55\uff0c\u8fdb\u4e00\u6b65\u63a8\u52a8HDI\u677f\u5728\u6d88\u8d39\u7535\u5b50\u3001\u6c7d\u8f66\u7535\u5b50\u3001\u822a\u7a7a\u822a\u5929\u7b49\u9886\u57df\u7684\u5e94\u7528\u7a81\u7834\u3002<\/span><\/span><\/div>\n
            \n

            \"A<\/p>\n<\/div>\n

            <\/p>","protected":false},"excerpt":{"rendered":"

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